LED Bonding Layout for Warped Substrate Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of disposing light-emitting diodes on a warped substrate is addressed by using a pressure bonding device with a flexible layer to align and join the diodes to bonding pads on the substrate, ensuring proper alignment even on curved surfaces.
Innovation Solution
A pressure bonding device with a flexible layer is used to attach light-emitting members to bonding pads on a substrate, allowing for alignment and connection even on warped surfaces by adjusting pitch and alignment to prevent multiple connections to a single pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-emitting diodes are joined to a substrate using conventional methods, then the joining process is simple, but the process becomes difficult when the substrate becomes warped
Solution Approach 1:
The patent applies dynamics by making the bonding device flexible rather than rigid. The bonding device includes a flexible layer that can dynamically adapt its shape to match the warped substrate surface, allowing the bonding heads to maintain contact and perform bonding operations on non-planar surfaces. This resolves the contradiction by enabling the joining process to accommodate substrate warping without requiring complex positioning systems.
Solution Approach 2:
The patent changes the physical parameter of the bonding device from rigid to flexible. By using a flexible layer with adjustable stiffness and conformability parameters, the device can adapt to different substrate warping degrees. This parameter change allows the same bonding device to work on both flat and warped substrates, resolving the contradiction between manufacturing simplicity and adaptability to warped surfaces.
2Adaptability or versatility
If a flexible bonding device is used to accommodate warped substrates, then adaptability to curved surfaces is improved, but device complexity increases
Solution Approach 1:
The patent directly applies flexible shells and thin films by using a flexible layer as the core component of the bonding device. This flexible layer can conform to warped substrate surfaces while maintaining structural integrity. The flexibility allows the device to adapt to curved surfaces without requiring complex mechanical adjustment mechanisms, thus achieving adaptability with relatively simple device architecture.
Solution Approach 2:
The bonding device is segmented into multiple bonding heads arranged in arrays, with each head independently capable of bonding operations. This segmentation allows the flexible device to conform to warped surfaces while maintaining operational simplicity at each segment level. The modular segmented structure reduces overall device complexity by distributing functionality across multiple independent units.
3Reliability
If pitch between electronic units is adjusted to prevent multiple connections to a single bonding pad, then connection reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements feedback by using vision systems or sensors to detect the actual positions of bonding pads and electronic units during the bonding process. This feedback information is used to adjust the pitch and positioning in real-time, ensuring that each electronic unit connects to the correct bonding pad without multiple connections. The feedback mechanism maintains connection reliability while reducing the stringency of pre-manufacturing pitch specifications.
Data Source
AI summary
An electronic device is provided, including a substrate and a plurality of electronic units disposed on the substrate. The substrate includes a first edge extending along a first direction and a second edge extending along a second direction. The electronic units include first, second, and third electronic units arranged adjacently along the first direction. The first electronic unit is closer to the second edge than the third electronic unit. A pitch between the second and third electronic units is greater than a pitch between the first and second electronic units. The electronic units include fourth, fifth and sixth electronic units arranged adjacently along the second direction. The fourth electronic unit is closer to the first edge than the sixth electronic unit. A pitch between the fourth and fifth electronic units is greater than a pitch between the fifth and sixth electronic units.