LED Package Metal Inlay With Bottom Contacts for Thermal Routing
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Solution Overview
Problem
The challenge in precision control lighting applications is the effective heat dissipation in small addressable LED lighting systems, where conventional heat dissipation methods through the top surface are impractical due to light emission, and existing solutions do not adequately address the thermal management needs of silicon backplanes and LED arrays.
Innovation Solution
A hybridized LED lighting system is developed with a packaging substrate featuring a metal inlay thermally coupled to the bottom surface, conductive vias, and conductive connectors, allowing for efficient heat dissipation through the bottom surface while accommodating a large number of passive components on the top surface, enabling effective thermal management and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is attempted through the top surface of the LED device, then heat removal may be achieved, but light emission is blocked and the device becomes less efficient
Solution Approach 1:
The patent inverts the conventional heat dissipation approach by directing heat removal through the bottom surface of the LED device rather than the top surface. The metal inlay embedded in the packaging substrate creates a thermal pathway from the LED chip through the substrate to the bottom surface, allowing heat to escape without interfering with light emission from the top surface.
Solution Approach 2:
The patent transitions heat dissipation from a two-dimensional top-surface approach to a three-dimensional pathway extending through the substrate thickness. The metal inlay creates a vertical thermal conduction path from the LED chip through the packaging substrate to the bottom surface, utilizing the z-dimension for heat removal while preserving the top surface for light emission.
2Volume of moving object
If the size of LED lighting systems is reduced for precision control applications, then compactness is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent applies local quality by concentrating thermal management functionality in a specific region - the metal inlay embedded in the packaging substrate. This localized thermal pathway provides efficient heat removal from the LED chip through the substrate bottom surface, enabling effective thermal management in compact device volumes without requiring extensive heat sink structures.
Solution Approach 2:
The patent uses composite material structures combining the packaging substrate with an embedded metal inlay. The metal inlay provides high thermal conductivity pathways through the otherwise lower-conductivity substrate material, creating a composite structure that achieves superior thermal management in a compact form factor suitable for precision control lighting applications.
3Ease of manufacture
If conventional packaging substrates are used without metal inlay, then manufacturing is simpler, but thermal conductivity is insufficient
Solution Approach 1:
The metal inlay acts as an intermediary thermal conduit between the LED chip and the external environment. Embedded in the packaging substrate, it provides a high thermal conductivity pathway that bridges the thermal gap, efficiently transferring heat from the LED chip through the substrate to the bottom surface while maintaining manufacturing feasibility through standard embedding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation and accommodates a high density of passive components, improving the thermal management and compactness of LED lighting systems, particularly in applications like vehicle headlamps and street lighting, where high performance and reduced size are critical.
Implementation Method 1
The metal inlay is thermally coupled to the bottom surface of the hybridized device
Data Source
AI summary
Light-emitting devices are described herein. A light-emitting device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening in the packaging substrate and conductive vias. The metal inlay is thermally coupled to the bottom surface of the hybridized device. Conductive contacts are disposed on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of conductive vias. Conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate. Each of the conductive connectors is electrically coupled to a respective one of the conductive contacts on the bottom surface of the packaging substrate by a respective on of the conductive vias.