Light Source Module Bracket Standardizes LED Assembly

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Solution Overview

Problem

The existing light source modules for automobile lighting require different mounting equipment for various semiconductor light emitting device packages and heat sinks, leading to increased manufacturing costs and complex quality control.

Innovation Solution

A light source module design that includes a heat sink with a mounting region, a light emitting device package, a circuit board, and a bracket that standardizes the connection between the package and the board using lead frames to simplify the assembly process and reduce equipment costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If different mounting equipment is used for various semiconductor light emitting device packages and heat sinks, then the light source module can be adapted to different automobile models, but manufacturing costs increase and quality control becomes difficult

Engineering Contradiction:
Improveadaptability to different automobile modelsVSAvoidmanufacturing cost and quality control
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent applies universality by designing a standardized mounting structure that can accommodate different semiconductor light emitting device packages and heat sinks through a single type of mounting equipment. The mounting structure includes a mounting board with standardized connection interfaces that can interface with various package types, eliminating the need for model-specific equipment while maintaining adaptability to different automobile lighting requirements

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent utilizes parameter changes by incorporating adjustable mounting positions and configurable connection configurations on the mounting board. The mounting structure allows modification of electrical connection parameters and mechanical mounting parameters through software or reconfigurable hardware, enabling the same physical equipment to adapt to different package sizes and heat sink configurations without requiring different mounting equipment

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If standardized mounting equipment is used for all light emitting device packages, then manufacturing costs decrease and quality control improves, but the ability to accommodate different automobile models may be limited

Engineering Contradiction:
Improvemanufacturing cost and quality controlVSAvoidadaptability to different automobile models
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The mounting board is designed with universal interfaces and standardized connection protocols that can work with multiple package types and heat sink configurations. The standardized design enables consistent manufacturing processes across different product variants while the configurable connection options maintain compatibility with various automobile model requirements

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The mounting structure is segmented into modular components including the mounting board, connection interfaces, and support structures. This segmentation allows the standardized mounting equipment to be configured for different applications by assembling appropriate modules, maintaining manufacturing simplicity while achieving adaptability to different automobile models through modular reconfiguration

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10711990B2Light source module
Publication Date: 2020.07.14 SAMSUNG ELECTRONICS CO LTD
  • US10711990B2 patent drawing
  • US10711990B2 patent drawing
  • US10711990B2 patent drawing

AI summary

A light source module includes a heat sink having a mounting region; a light emitting device package having a first surface disposed on the mounting region of the heat sink and a second surface that is opposite to the first surface, the light emitting device package including a connection pad disposed on the second surface; a circuit board disposed on the mounting region of the heat sink and spaced apart from the light emitting device package, the circuit board including a connector and a terminal electrically connected to the connector; and a bracket disposed between the light emitting device package and the circuit board on the mounting region of the heat sink, and coupled to the heat sink, the bracket including a lead frame pressing the connection pad and the terminal to connect the connection pad and the terminal.