LED Package Buffer Layer Prevents Delamination
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Solution Overview
Problem
Light emitting devices using III-V nitride semiconductors face challenges in protecting the light emitting structure from external shocks and moisture, which can lead to interlayer shorts and delamination issues during manufacturing and operation.
Innovation Solution
Incorporating a buffer layer and a protective layer with improved adhesive strength, the buffer layer is positioned between the protective layer and the adhesion layer to enhance the adhesive properties and prevent delamination, while the protective layer is designed to prevent light emission and moisture exposure, using materials like Ti, Ni, and transmissive oxides to improve light extraction efficiency and prevent interlayer shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is added to prevent moisture and external shocks, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent employs a multi-layer composite structure consisting of a protective layer, adhesion layer, and buffer layer. Each layer is made of specific materials (e.g., oxide for protective layer, metal for adhesion layer) that work together to provide comprehensive protection against moisture and external shocks while maintaining structural integrity and reliability.
2Reliability
If adhesive strength is improved to prevent delamination, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent introduces an adhesion layer as an intermediary between the protective layer and the underlying structure. This intermediate layer specifically addresses the bonding interface, providing enhanced adhesive strength and preventing delamination without requiring extremely high manufacturing precision for the entire device structure.
3Productivity
If light extraction efficiency is improved using transmissive oxides, then productivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes transmissive oxide materials with specific optical parameters (high transparency to emitted light) to improve light extraction efficiency. By carefully selecting oxide materials and controlling their thickness parameters, the device achieves enhanced light extraction without requiring complex multi-component material compositions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the reliability of light emitting devices by improving adhesive strength, preventing delamination, and maintaining light extraction efficiency, even under high moisture conditions, thus improving the overall performance and durability of the devices.
Implementation Method 1
the buffer layer is positioned between the protective layer and the adhesion layer to enhance the adhesive properties and prevent delamination
Implementation Method 2
the protective layer is designed to prevent light emission and moisture exposure, using materials like Ti, Ni, and transmissive oxides
Implementation Method 3
using materials like Ti, Ni, and transmissive oxides to improve light extraction efficiency
Data Source
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AI summary
Disclosed are a light emitting diode (100) and a light emitting diode package (30) having the same. The light emitting diode includes a light emitting structure (135) including a first conductive semiconductor layer (110), a second conductive semiconductor layer (130), and an active layer (120) interposed between the first conductive semiconductor layer and the second conductive semiconductor layer, an electrode (115) electrically connected to the first conductive semiconductor layer, a reflective layer (150) under the second conductive semiconductor layer, a protective layer (140) disposed around a lower surface of the second conductive semiconductor layer, and a buffer layer (155) disposed on at least one of top and lower surfaces of the protective layer.