Nonlinear Lead Frame Buffering for Thermal Expansion in LED Modules

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Solution Overview

Problem

The relative positioning of light emitting modules and optical elements in flat panel displays affects luminance, with increased distance leading to light loss and deformation of light guide plates due to heat, causing potential disconnection from the power source.

Innovation Solution

A light emitting module design featuring a lead frame with a buffering portion that absorbs external forces, preventing separation from the printed circuit board, and includes a nonlinear shape to absorb impact and thermal expansion forces, ensuring stable attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the light emitting module is disposed close to the optical element to minimize light loss, then luminance is improved, but the light guide plate expands and deforms due to heat, causing separation of the light emitting module from the printed circuit board

Engineering Contradiction:
ImproveluminanceVSAvoidstructural stability
Core Design Contradiction:
Illumination intensityVSStability of the object's composition

Solution Approach 1:

The patent introduces a buffering portion with a nonlinear shape (such as U-shape or arch shape) in the lead frame structure between the connecting portion and mounted portion. This buffering portion acts as a pre-designed cushioning element that can deform elastically to absorb thermal expansion forces and external impacts before they reach the mounted portion, thereby preventing separation of the light emitting module from the printed circuit board while maintaining close proximity to the optical element for high luminance

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Loss of energy

If the light emitting module is disposed close to the optical element, then light transmission is improved, but the light guide plate deforms due to heat, leading to disconnection from power source

Engineering Contradiction:
Improvelight lossVSAvoidconnection reliability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The buffering portion is designed in advance with elastic deformation capability to absorb thermal expansion forces and external impacts. The nonlinear shape (U-shape, arch shape, or sinusoidal shape) allows the lead frame to flex and cushion forces before they can cause disconnection, ensuring reliable electrical connection while maintaining optimal light transmission distance

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent changes the geometric parameters of the lead frame by introducing a buffering portion with nonlinear shape. This structural parameter change enables the lead frame to have elastic deformation capability, allowing it to absorb thermal expansion and external forces dynamically, thus maintaining connection reliability under varying thermal and mechanical conditions

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively reduces movement and disconnection of the light emitting module due to external forces, maintaining luminance and preventing separation from the printed circuit board, thereby enhancing the reliability of the light providing assembly.

Implementation Method 1

the buffering portion is disposed between the connecting portion and the mounted portion, and has a generally nonlinear shape protruding in a direction substantially perpendicular to the first direction

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS8696185B2Light emitting module and light providing assembly having the same
Publication Date: 2014.04.15 SAMSUNG DISPLAY CO LTD
  • US8696185B2 patent drawing
  • US8696185B2 patent drawing
  • US8696185B2 patent drawing

AI summary

A light emitting module includes a light emitting chip generating light, a case and a lead frame. The case includes a bottom plate and sidewalls connected to the bottom plate. The bottom plate and the sidewalls define a receiving space in which the light emitting chip is received. The light is emitted in a first direction through an opening portion opposite to the bottom plate. The lead frame includes an electrode portion disposed in the case, and electrically connected to the light emitting chip, a connecting portion extending from the electrode portion and disposed outside of the case, a mounted portion disposed adjacent to the connecting portion, and a buffering portion disposed between the connecting portion and the mounted portion. The buffering portion has a generally nonlinear shape protruding in a direction substantially perpendicular to the first direction.