LED Bulb Heat Dissipation Using Gas-Filled Hollow Body
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Solution Overview
Problem
LED lighting devices face challenges in heat dissipation and high manufacturing costs, which affect their efficiency and competitiveness.
Innovation Solution
The LED bulb apparatus features a hollow main body with a light source module, end covers, and connectors, incorporating a driver and rectifier diodes on a base plate, with a heat dissipation gas and fluorescent layer to manage temperature and reduce manufacturing complexity, using conductive wires and a temperature sensor to adjust driving current, and embedding components for efficient assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED components are operated at high power to emit strong light, then illumination intensity is improved, but temperature increases causing heat dissipation problems
Solution Approach 1:
The patent converts the harmful heat generated by high-power LED operation into a beneficial effect by filling the bulb with heat dissipation gas (xenon, krypton, or nitrogen) that actively absorbs and conducts heat away from the LED components, transforming the thermal problem into a controlled heat transfer mechanism that maintains LED operational temperature while preserving high illumination output
Solution Approach 2:
The patent employs gas-filled pneumatic environment within the bulb to manage heat dissipation. By introducing specific gases (xenon, krypton, or nitrogen) at controlled pressures, the system uses gas conduction and convection to transfer heat from the LED components to the bulb walls, enabling high-power operation without thermal damage
2Ease of manufacture
If traditional LED bulb structures are used, then manufacturing is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent changes the physical parameters of the bulb environment by introducing specific gases (xenon, krypton, or nitrogen) at optimized pressures and compositions. This parameter modification enhances heat conduction and convection coefficients within the bulb, significantly improving heat dissipation efficiency while maintaining the simplicity of the overall bulb structure and manufacturing process
3Temperature
If more heat dissipation materials are added to improve heat dissipation, then temperature control is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive solid heat dissipation materials with relatively inexpensive heat dissipation gases (xenon, krypton, or nitrogen) that can be introduced into the bulb during or after manufacturing. This gas-filled approach achieves superior heat dissipation performance without the high costs associated with complex solid heat sink structures, special coatings, or additional thermal management components
Solution Approach 2:
The patent optimizes heat dissipation by modifying the gaseous environment parameters (gas type, pressure, composition) rather than adding substantial amounts of expensive heat dissipation materials. This parameter-based approach achieves effective thermal management at lower manufacturing costs compared to material-intensive solutions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation, reduces manufacturing costs, improves assembly efficiency, and increases the bulb's overall performance and competitiveness by integrating components and using heat dissipation materials like metal powder.
Implementation Method 1
The two end covers are fixed on two ends of the main body for closing the hollow structure for forming a closed container for storing the light source module and a heat dissipation gas
Implementation Method 2
a heat dissipation gas... for managing temperature
Implementation Method 3
a fluorescent layer is covered on both the light source and the driver
Implementation Method 4
a heat dissipation material is mixed in the fluorescent layer. In addition, the heat dissipation material may be metal powder like copper, silver with reflective characteristics
Implementation Method 5
Such metal powder may help heat dissipation and also increase light effect
Implementation Method 6
the LED bulb apparatus also includes a temperature sensor for detecting an operation temperature of the light source module
Implementation Method 7
the driver adjusts a driving current supplied to the light source module by reference to the operation temperature detected by the temperature sensor
Data Source
AI summary
A LED bulb apparatus includes a main body, a light source, two end covers, and two connectors. The main body is a hollow structure. The light source module is disposed inside the main body. The light source module has a base plate, a driver and a light source. The driver and the light source being are mounted on the base plate. The two end covers are fixed on two ends of the main body for closing the hollow structure for forming a closed container for storing the light source module and a heat dissipation gas.