LED Candle Flame Light Thermal Management and Shape Retention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current candle flame lights, including COB LED strip lights, face issues with flexible filaments that distort when illuminated, generate heat, pose safety hazards, and have limited wattage capacity, as well as inadequate protection from impacts and inflexibility in shape variations.
Innovation Solution
The design features a base member with screw threads, an inner transparent cover that maintains the filament's shape, an outer transparent cover for impact protection, and a heat sink member to absorb and dissipate heat, allowing for interchangeable outer covers and increased wattage capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flexible filaments are used in candle flame lights, then the light can be manufactured with simple structures, but the filaments form misshaped appearances when illuminated
Solution Approach 1:
The patent applies a flexible transparent cover that conforms to the filament's shape while maintaining structural support. This cover is designed to be flexible enough to accommodate the filament's natural form during manufacturing but rigid enough to maintain the filament's shape during illumination, resolving the contradiction between manufacturing simplicity and shape maintenance.
Solution Approach 2:
The patent divides the protective structure into separate components: an inner transparent cover that directly encloses the filament and an outer cover that provides additional protection. This segmentation allows each component to be optimized independently - the inner cover for shape maintenance and the outer cover for impact protection - while simplifying the overall manufacturing process.
2Power
If filaments generate heat, then the light can be illuminated, but the transparent glass covers get hot presenting a safety hazard
Solution Approach 1:
The patent introduces a heat sink member as an intermediary component between the filament and the transparent covers. This heat sink absorbs and dissipates heat generated by the filament before it can transfer to the covers, thereby maintaining illumination capability while eliminating the safety hazard of hot covers.
Solution Approach 2:
The patent converts the harmful heat generated by the filament into a beneficial function by using the heat sink member to absorb and dissipate this heat. The heat that would otherwise cause safety hazards is instead utilized to maintain the filament's operating temperature and prevent overheating, transforming a harmful effect into a useful one.
3Power
If heat is generated by the filament, then illumination is achieved, but the light's wattage capacity is limited
Solution Approach 1:
The heat sink member serves as a thermal intermediary that decouples the filament's power output from the temperature rise. By providing an additional heat dissipation pathway through the heat sink, the system can accommodate higher wattage filaments without experiencing excessive temperature rise, thereby increasing wattage capacity.
Solution Approach 2:
The patent changes the thermal management parameters of the system by introducing the heat sink member with specific thermal conductivity and surface area characteristics. This allows the system to handle higher power levels by optimizing heat dissipation rates, effectively increasing the operational wattage capacity while maintaining safe temperatures.
4Device complexity
If current covers are used, then the filament is enclosed, but the covers do not adequately protect from impacts
Solution Approach 1:
The patent segments the protective function into two distinct covers: an inner transparent cover that provides basic enclosure and shape maintenance, and an outer cover that provides enhanced impact protection. This segmentation allows each cover to be optimized for its specific function, with the outer cover being thicker and more durable to absorb impacts while the inner cover maintains filament shape.
Solution Approach 2:
The patent employs a nested structure where the inner transparent cover is enclosed within the outer cover. This nested arrangement allows the inner cover to maintain filament shape while the outer cover provides impact protection, combining the benefits of both simple enclosure and robust protection without significantly increasing overall device complexity.
5Ease of manufacture
If single-shaped covers are used, then manufacturing is simplified, but shape variety is limited
Solution Approach 1:
The patent separates the cover into inner and outer components that can be manufactured independently. The inner cover can be produced in a standard shape using simple manufacturing processes, while the outer cover can be customized in various shapes and designs. This segmentation enables shape variety without significantly complicating the manufacturing of individual components.
Solution Approach 2:
The inner transparent cover serves multiple functions: it maintains filament shape, provides basic protection, and acts as a mounting surface for the outer cover. This multi-functionality allows the inner cover to be designed as a universal component that can work with various outer cover shapes, enabling shape variety while maintaining manufacturing simplicity through standardization of the inner cover.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains the filament's shape, prevents overheating, enhances safety through heat dissipation and impact protection, and allows for versatile shape options while enabling higher wattage and longer illumination.
Implementation Method 1
A heat sink member has an upper section with screw threads and a lower section comprising a heat sink component fabricated of heat absorbent material. The heat sink component is configured to absorb heat generated by the filament.
Implementation Method 2
The heat sink component is configured to absorb heat generated by the filament
Implementation Method 3
heat is absorbed and dissipated through the heat sink member
Data Source
AI summary
An LED candle flame light has a base member and an LED candle flame light filament component which extends upwardly therefrom. An inner transparent cover having the same outline shape of the filament is formfitted around the filament and encases it. An outer transparent cover encloses the inner cover. A heat sink member has an upper section and a lower section having a heat sink component fabricated of heat absorbent material. The heat sink component is configured to absorb heat generated by the filament. The component is threadably engaged to the base member such that it is adjacent to the base member, allowing it to absorb heat generated by the filament components. The outer covers can be of different shapes and are interchangeably attached to the base member.