Water-Resistant LED Capture Assembly With Compressive Wire Seals
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Solution Overview
Problem
Existing light strings lack effective water-resistant encapsulation methods, leading to potential water ingress and requiring complex assembly processes, which can increase costs and reduce assembly yield.
Innovation Solution
A water-resistant capture device comprising a base module and a cap module that compresses wires within deformable apertures, providing a compressive seal and allowing for easy assembly and replacement of electro-magnetic components without molding, with features like deformable seals and tactile alignment for proper positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional molding operations are used to encapsulate electro-magnetic components, then water resistance is achieved, but assembly complexity increases and manufacturing costs rise
Solution Approach 1:
The capture device is divided into separate base module and cap module components that can be assembled without molding operations. The base module contains wire apertures and alignment features, while the cap module provides the sealing interface, allowing modular assembly and field replacement without complex molding processes
Solution Approach 2:
The deformable base module acts as an intermediary that provides both mechanical support and water sealing through its deformable material properties. When the cap module is attached, the deformable base module compresses to create a water-resistant seal around the electro-magnetic component and wires, eliminating the need for complex molding-based encapsulation
2Reliability
If complex assembly processes are used to ensure water resistance, then sealing integrity is improved, but assembly yield decreases and costs increase
Solution Approach 1:
The deformable base module automatically provides compressive sealing action when the cap module is attached, without requiring additional sealing operations or complex assembly steps. The material itself performs the sealing function through its deformability, simplifying the assembly process and improving yield
Solution Approach 2:
The base module utilizes changes in material deformation parameters to achieve sealing. When compressed between the cap module and the electro-magnetic component, the deformable material changes its physical state to create a water-resistant seal, providing reliable sealing through parameter change rather than complex assembly procedures
3Object-affected harmful factors
If molded encapsulation is used to protect components, then environmental protection is improved, but field replaceability is reduced
Solution Approach 1:
The capture device is segmented into removable base and cap modules that can be easily separated and reassembled, enabling field replacement of electro-magnetic components while maintaining water protection through the modular design and deformable sealing interface
Solution Approach 2:
The deformable base module provides dynamic sealing that adapts to component removal and reinstallation. The material's deformability allows it to maintain sealing integrity during assembly and disassembly operations, enabling field replaceability while preserving environmental protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances water resistance, simplifies assembly, improves yield, reduces costs, and allows for field replacement of components, while maintaining electrical connectivity and sealing integrity.
Implementation Method 1
the base module may be deformable and deform when affixed to the cap module so as to form a compressive water-resistant seal to an interior of the capture device
Implementation Method 2
one or more electric wires are compressed within deformable wire apertures formed by the combined base module and cap module
Data Source
AI summary
Apparatus and associated methods relate to a water-resistant capture device for enclosing wired electro-magnetic components, the capture device having a base module and a connecting cap module, wherein when the base module and cap module enclose an electro-magnetic component and the base module is connected to the cap module, one or more electric wires are compressed within deformable wire apertures formed by the combined base module and cap module. In some embodiments, the base module is deformable and deforms when affixed to the cap module so as to form a compressive water-resistant seal to an interior of the capture device. In an exemplary embodiment, an LED may be captured within the capture device. The cap module may provide a compressing aperture to provide a water resistant seal around the lens of a LED projecting therethrough.