LED Carrier Injection Layer Work Function Engineering

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Solution Overview

Problem

Current light emitting diodes (LEDs) face challenges in achieving high current injection efficiency due to high contact resistance between p-type semiconductor layers and electrodes, limiting their light extraction and quantum efficiency.

Innovation Solution

Incorporating a hole injection layer with a critical thickness between the p-type semiconductor layer and the electrode, and a carrier injection layer with a high work function, specifically formed with a metal oxide, to increase the work function difference and enhance hole injection efficiency, thereby improving current injection and light emission efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional LED structure without additional injection layers is used, then the device complexity is low, but the current injection efficiency is limited due to high contact resistance

Engineering Contradiction:
Improvecurrent injection efficiencyVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A hole injection layer is introduced as an intermediary between the p-type semiconductor layer and the electrode. This layer has a work function specifically designed to be higher than both the p-type semiconductor layer and the electrode, creating a favorable work function gradient that enhances hole injection efficiency while managing contact resistance

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The work function parameter is strategically modified by introducing the hole injection layer with a higher work function than the adjacent layers. This parameter change creates an optimized work function difference that directly addresses the contact resistance issue and improves current injection efficiency

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the work function difference between the p-type semiconductor layer and electrode is increased, then hole injection efficiency improves, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvehole injection efficiencyVSAvoidwork function control precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The work function is used as a key control parameter, with the hole injection layer designed to have a work function higher than both the p-type semiconductor layer and the electrode. This parameter-based approach provides a clear design criterion that guides material selection and layer design

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The hole injection layer is designed with specific local properties - a work function that is locally higher than the adjacent layers. This localized quality enhancement at the critical interface region optimizes hole injection without requiring precision control throughout the entire device structure

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The insertion of these layers increases hole injection efficiency, leading to improved electron-hole recombination and overall light emission efficiency of the LED chip, enhancing its quantum efficiency and light output.

Implementation Method 1

a carrier injection layer with a high work function, specifically formed with a metal oxide, to increase the work function difference and enhance hole injection efficiency

Methodology Applied
Scientific EffectWork function difference:

Data Source

PatentUS9362457B2Light emitting device, light emitting device package and lighting system including the same
Publication Date: 2016.06.07 SUZHOU LEKIN SEMICON CO LTD
  • US9362457B2 patent drawing
  • US9362457B2 patent drawing
  • US9362457B2 patent drawing

AI summary

A light emitting device (LED), an LED package, and a lighting system including the LED package are provided. The light emitting device (LED) may include a light emitting structure, a carrier injection layer, and an electrode layer. The light emitting structure may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. The carrier injection layer may be positioned over the light emitting structure, and the electrode layer may be positioned over the carrier injection layer.