LED Carrier with Integrated ESD Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED carrier systems face challenges in miniaturization, thermal management, light emission characteristics, and protection against electrostatic discharges, particularly in mobile applications where space and height are critical, and discrete ESD protective components can negatively impact these aspects.
Innovation Solution
A carrier with an integrated protective device against electrostatic discharges within the base body, allowing for miniaturization and unobstructed light emission, featuring metallic surfaces for thermal management and electrical contacting, and a heat spreader for efficient heat dissipation, while maintaining low coplanarity and surface roughness of contact surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete ESD protective components are provided on the upper side of the carrier, then protection against electrostatic discharges is achieved, but the overall height and space requirement increase and light emission characteristics are influenced
Solution Approach 1:
The protective device against electrostatic discharges is integrated into the base body of the carrier, merging two previously separate functions (carrier structure and ESD protection) into a single unified component. This eliminates the need for discrete protective components on the upper side, thereby reducing overall height and space requirements while maintaining ESD protection functionality
Solution Approach 2:
The protective device is embedded within the base body structure, transitioning from a surface-mounted discrete component to an integrated three-dimensional structure. This dimensional integration allows the protective function to coexist with the carrier structure without increasing the upper surface area or overall height
2Reliability
If discrete ESD protective components are provided on the upper side of the carrier, then protection against electrostatic discharges is achieved, but light emission characteristics are influenced
Solution Approach 1:
By integrating the protective device into the base body, the upper side surface is kept clear and free of discrete protective components. This ensures unobstructed light emission from the LED while the base body itself provides the ESD protection function through integrated metallic surfaces and conductive structures
3Ease of manufacture
If the carrier is soldered onto a circuit board at high temperature, then electrical connection is achieved, but the connection between LED and carrier may melt and LED orientation may change
Solution Approach 1:
The base body is designed with non-uniform structure, featuring a first region with higher mass moment of inertia specifically positioned to provide thermal mass and mechanical stability during soldering. This localized structural optimization allows the carrier to withstand soldering temperatures without causing LED connection failure or orientation changes
Solution Approach 2:
The base body structure is pre-designed with appropriate mass distribution and mechanical properties before the soldering process. This beforehand structural preparation provides inherent resistance to thermal stress and mechanical displacement during the soldering operation, preventing damage to the LED-carrier connection
4Illumination intensity
If the upper side of the carrier is free of components, then light emission is unobstructed, but thermal management becomes more challenging
Solution Approach 1:
Metallic surfaces are applied to the base body to serve as an intermediary thermal conduction path. These metallic surfaces facilitate heat transfer from the LED to the base body and ultimately to the mounting surface, enabling effective thermal management while keeping the upper side surface free for optimal light emission
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved miniaturization, unimpeded light emission, effective thermal management, and protection against electrostatic discharges, ensuring the LED's operational stability and efficiency in compact mobile applications.
Implementation Method 1
For thermal management, there should be as good a thermal contact as possible between the LED, the carrier and the carrier surface
Implementation Method 2
a protective device for protecting an LED mounted on the carrier against electrostatic discharges being integrated into the base body
Data Source
Figure 1~2
Figure 3~4
Figure 5~8
AI summary
The invention relates to a carrier (1) for an LED (2) which has a main body (5), wherein a protection device (6) for protecting an LED (2) mounted on the carrier (1) against electrostatic discharges is integrated in the main body (5).