LED Assembly Using Carrier Matrix for Precise Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in accurately aligning surface-mounted lighting elements, such as LEDs, during the soldering or gluing process on a substrate, as they tend to shift due to inadequate adhesion, leading to misalignment and potential damage during assembly, especially when combined with optical components like collimators.
Innovation Solution
A method where the lighting element and a support element are aligned and mounted within a single plane on a substrate, using a carrier matrix to define precise distances, allowing for secure bonding and subsequent mounting of optical components without mechanical stress on the lighting element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflow soldering process is used to bond LEDs onto substrate, then electrical connection is achieved, but components tend to swim away during heating leading to misalignment
Solution Approach 1:
The patent applies preliminary action by pre-assembling the LED and support element in a carrier matrix at precise positions before mounting onto the substrate. This pre-positioning ensures that even during the soldering process when components may swim, the initial precise alignment is maintained through the carrier matrix structure, resolving the contradiction between bonding reliability and alignment precision.
Solution Approach 2:
The carrier matrix serves as an intermediary device that holds both the LED and support element in precise relative positions during assembly. This intermediary structure enables accurate alignment to be maintained throughout the soldering process, allowing reliable bonding without sacrificing positioning precision.
2Manufacturing precision
If optical components are mounted onto substrate separately after LEDs, then alignment accuracy is difficult to achieve, but mounting in one step increases process complexity
Solution Approach 1:
The patent merges the mounting of LEDs and support elements into a single simultaneous process step by placing both components in the carrier matrix together. This combining approach achieves precise alignment between optical components and LEDs in one operation, eliminating the need for separate mounting steps while maintaining high alignment accuracy.
Solution Approach 2:
The carrier matrix serves multiple functions: it positions LEDs, positions support elements, maintains precise distances between them, and enables simultaneous mounting. This multi-functional design achieves accurate alignment without increasing overall process complexity, as the same structure performs all alignment tasks.
3Volume of moving object
If support element is placed close to LED for compact design, then mechanical stress may damage LED during assembly, but larger distance increases component size
Solution Approach 1:
The support element acts as an intermediary structure positioned between the LED and the mounting substrate. It provides mechanical support and stress distribution while maintaining a controlled distance from the LED, enabling compact design without subjecting the LED to damaging mechanical stress during assembly operations.
Solution Approach 2:
The patent applies local quality by providing structural support and stress distribution specifically in the regions where mechanical forces are applied, while maintaining close proximity to the LED for compactness. The support element's geometry and material properties are optimized to provide protection exactly where needed without increasing overall assembly volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate and efficient alignment and assembly of lighting and optical components, preventing misalignment and damage, while allowing for a condensed and precise arrangement of components, suitable for applications like automotive lighting units.
Implementation Method 1
a conducting paste is applied to bonding pads on the circuit board. The electrical components are attached onto the bonding pads by adhesion of the paste
Implementation Method 2
the circuit board with the attached components is subjected to a heating process. During this process, the conducting paste becomes solid
Data Source
AI summary
The present application relates to assembling a lighting element (20) onto a substrate (28). To enable exact positioning of the lighting element (20) and further optical components (30), there is provided aligning the lighting element (20) with a support element (22) within one mounting plane P using an auxiliary carrier (24), surface mounting the lighting element (20) together with the support element (22) onto a substrate (28) within one step e.g. by reflow soldering, and mounting a further component (30) onto the support element (22) such that no mechanical stress is applied to the lighting element (20).