LED Carrier Plate Structure for Accurate Chip Mass Transfer

The dissociable-adhesive layer is segmented into multiple independent microcavities, each containing a light-emitting-diode chip. This segmentation prevents gas from spreading across the entire adhesive layer, confining it to localized areas and minimizing position deviation during chip transfer.

A gas exhaust structure is introduced as an intermediary component between the dissociable-adhesive layer and the external environment. This structure provides a controlled pathway for gas to escape during the dissociation process, preventing gas accumulation that would cause chip position deviation while maintaining the integrity of the mass transfer system.

The adhesive layer is divided into discrete microcavities, each acting as an independent dissociation unit. This segmentation enables precise control over the dissociation process at each chip location, improving dissociation accuracy while maintaining high transfer efficiency across the entire array.

The gas exhaust structure serves as a mediator that facilitates controlled gas removal during dissociation. By providing dedicated exhaust pathways for each microcavity, the system achieves accurate dissociation timing and positioning without the adverse effects of uncontrolled gas formation.

The gas generated during dissociation, which initially causes position deviation, is converted into a beneficial element by channeling it through controlled exhaust pathways. The gas pressure is utilized to facilitate chip release while the exhaust structure ensures it escapes in a controlled manner, preventing yield reduction.

The gas exhaust structure acts as an intermediary that mediates between the gas generation process and the chip transfer outcome. It provides a controlled interface for gas removal, ensuring that the dissociation process proceeds reliably without compromising chip position or reducing transfer yield.