Light Emitting Package Cavity Depth Control via Bonded Body Segmentation
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Solution Overview
Problem
The variance in the depth of the cavity where a light emitting chip is mounted in a light emitting package can lead to color temperature binning issues due to variations in etching liquid concentration, etching time, and etching temperature, affecting the uniformity of phosphor distribution.
Innovation Solution
A light emitting package design featuring a package body with a cavity, separate electrodes, dielectric layers, and impurity regions, including zener diodes, where the second body is doped with impurities and directly bonded to the first body, with a phosphorescence layer and resin layer filling the cavity to maintain consistent chromaticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-body package structure is used, then the device complexity is reduced, but the manufacturing precision of cavity depth varies significantly
Solution Approach 1:
The package body is divided into two separate bodies (first body and second body) that are bonded together. The cavity is formed in the first body with a controlled depth, while the second body is bonded to the first body. This segmentation allows precise control of the cavity depth in the first body without being affected by variations in the overall package structure, thereby improving manufacturing precision while maintaining reasonable device complexity.
2Productivity
If etching parameters are varied, then the productivity of cavity formation is improved, but the manufacturing precision of cavity depth deteriorates
Solution Approach 1:
The cavity depth is predetermined and controlled during the formation of the first body, before the actual etching process. By pre-establishing the cavity depth in the first body structure, the subsequent etching process can proceed at high speed without compromising the precision of the cavity depth, as the depth control is already built into the structure rather than relying solely on etching parameter control.
3Ease of manufacture
If phosphors are spread after cavity formation, then the ease of manufacture is improved, but color temperature binning occurs due to depth variance
Solution Approach 1:
The cavity depth is predetermined and controlled during the formation of the first body, before phosphor application. By establishing a uniform cavity depth in advance, the subsequent phosphor spreading process can be performed easily without causing color temperature binning, as the uniform cavity provides a consistent base for uniform phosphor distribution.
4Manufacturing precision
If a two-body bonded structure is used, then the manufacturing precision of cavity depth is improved, but the device complexity increases
Solution Approach 1:
The first body containing the precision-controlled cavity and the second body are bonded together to form an integrated package structure. This merging combines the advantages of precise cavity depth control from the first body with the functional requirements of the second body, achieving high manufacturing precision while maintaining a unified package structure that does not excessively increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent light emission by controlling the depth of the cavity and preventing non-uniform chromaticity, enhancing light efficiency and color stability across the package.
Implementation Method 1
a package body including a first body and a second body bonded to the first body
Implementation Method 2
the second body is doped with impurities of a first type
Implementation Method 3
the at least two impurity regions and the second body include at least one zener diode
Implementation Method 4
at least one of a phosphorescence layer and a resin layer on the light emitting element, the phosphorescence layer and resin layer filling at least a portion of the cavity
Data Source
AI summary
Example embodiments are directed to a light emitting package having a structure that prevents variance in a depth of a cavity in which a chip is mounted and a method of fabricating the same. A light emitting package includes a package body including a first body including the cavity and a second body bonded to the first body. The cavity penetrates the first body. A first electrode and a second electrode separate from each other are on the package body. A first dielectric layer is between the package body and the first electrode and between the package body and the second electrode. A light emitting element is placed in the cavity and electrically connected to the first electrode and the second electrode. A method of fabricating the light emitting package includes forming the first body and the second body bonded to the first body through a dielectric layer, forming the cavity in the first body and forming the light emitting element in the cavity.