LED Cavity Package Thermal Management
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Solution Overview
Problem
Conventional white light LEDs face issues with thermal quenching due to heat generation, which affects the color fidelity of the emitted light, as the converter material's temperature change causes it to emit light at a different frequency, resulting in off-white appearances.
Innovation Solution
The proposed solution involves a microelectronic LED package design with a conductive substrate having a cavity for the LED and converter material, incorporating a reflective material and an electrostatic dissipation chip, along with a filler to isolate electrical portions and manage heat effectively, while using a phosphor material to achieve desired color emissions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If converter material is deposited on LED die to generate white light, then color emission is achieved, but thermal quenching occurs causing color fidelity degradation
Solution Approach 1:
The patent extracts the converter material from direct contact with the LED die by placing it in a cavity below the LED, separating the light generation function from the heat source to reduce thermal quenching effects while maintaining white light emission
Solution Approach 2:
The patent introduces a reflective cavity and thermal management structures as intermediaries between the LED die and converter material, allowing heat to be directed away from the converter material while maintaining optical coupling for white light generation
2Productivity
If LED die generates light at specific wavelength, then efficient light emission is achieved, but heat is produced causing converter material temperature increase
Solution Approach 1:
The patent segments the LED package into distinct functional zones: a light emission zone with the LED die, a thermal management zone with heat sinking structures, and a light conversion zone with the converter material in the cavity, allowing each to optimize its function independently
Solution Approach 2:
The patent converts the harmful heat generated by the LED die into a beneficial thermal management opportunity by using heat sinking structures and cavity design to direct heat away from the converter material, transforming the waste heat into a controlled thermal environment that protects color fidelity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the thermal management and color fidelity of the LED package by maintaining the desired light frequency emissions, improving the perceived white light output and reducing thermal quenching effects.
Implementation Method 1
The LED die 4 can include one or more light emitting components... the InGaN material 16 of the LED die 4 emits a blue light that stimulates the converter material 6 to emit a light (e.g., a yellow light) at a desired frequency
Implementation Method 2
One operational difficulty of the LED device 10 is that the LED die 4 produces a significant amount of heat. The generated heat raises the temperature of the converter material 6, and thus causes the converter material 6 to emit light at a different frequency than the desired frequency (a phenomenon commonly referred to as 'thermal quenching')
Data Source
AI summary
Several embodiments of light emitting diode packaging configurations including a substrate with a cavity are disclosed herein. In one embodiment, a cavity is formed on a substrate to contain an LED and phosphor layer. The substrate has a channel separating the substrate into a first portion containing the cavity and a second portion. A filler of encapsulant material or other electrically insulating material is molded in the channel. The first portion can serve as a cathode for the LED and the second portion can serve as the anode.