Semiconductor LED Cell Assembly With Magnetic Solder Alignment
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Solution Overview
Problem
Current display technologies face challenges in efficiently self-assembling semiconductor light emitting diodes of different colors on a substrate simultaneously and securely connecting them to prevent separation, particularly for large-area displays.
Innovation Solution
The use of recessed portions on semiconductor light emitting diodes and corresponding solder portions on the substrate, including ohmic electrodes and a magnetic layer, allows for simultaneous self-assembly and stable electrical connection, leveraging magnetic forces for secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to assemble semiconductor light emitting diodes on a substrate, then assembly time is reduced and productivity is improved, but the semiconductor light emitting diodes may separate from the substrate due to insufficient connection strength
Solution Approach 1:
The connection structure is divided into multiple functional layers: a magnetic layer for initial self-assembly attraction, an ohmic electrode layer for electrical connection, and a solder portion for mechanical bonding. This segmentation allows each layer to perform its specific function optimally while working together to achieve both fast assembly and strong connection.
Solution Approach 2:
The connection structure uses composite material design by combining materials with different properties: magnetic material for attraction, conductive material for electrical connection, and solder material for mechanical bonding. This composite approach enables simultaneous achievement of magnetic assembly, electrical connectivity, and mechanical strength.
2Productivity
If multiple semiconductor light emitting diodes of different colors are assembled simultaneously, then productivity is improved, but position selectivity becomes difficult to achieve
Solution Approach 1:
Different regions of the substrate are equipped with different properties: certain areas have magnetic layers for attracting specific colored LEDs, while other areas have ohmic electrodes and solder portions for electrical connection and mechanical bonding. This local differentiation enables position-selective self-assembly of different colored LEDs simultaneously.
Solution Approach 2:
The magnetic layer acts as an intermediary that mediates the self-assembly process by providing position-selective attraction for different colored LEDs. The intermediary structure enables simultaneous assembly of multiple colored LEDs at their designated positions without requiring complex external manipulation.
3Reliability
If a magnetic layer is added to the solder portion, then connection strength and reliability are improved, but device complexity increases
Solution Approach 1:
The magnetic layer is designed to serve multiple functions: it provides magnetic attraction for self-assembly, enables position-selective placement, and contributes to the overall connection strength. By making the magnetic layer multi-functional, the patent reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The magnetic layer is merged with the solder portion and electrode structure to form an integrated connection structure. This merging combines the magnetic attraction function with the electrical connection and mechanical bonding functions in a single unified structure, reducing overall device complexity compared to using separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster assembly of semiconductor light emitting diodes of different colors on a substrate, enhancing the stability and efficiency of the display device by ensuring secure electrical connections and minimizing separation risks.
Implementation Method 1
a solder portion of the substrate may include a magnetic layer
Implementation Method 2
a recessed portion and a solder portion may include an ohmic electrode and a wiring electrode for electrical connection
Data Source
Figure 1
Figure 2~3
Figure 4~5B
AI summary
A display apparatus according to an embodiment of the present invention comprises: a base part; assembly electrodes formed on the base part and extending along one direction; a dielectric layer formed to cover the assembly electrodes; a partition wall part laminated on the dielectric layer while forming a plurality of cells; and semiconductor light-emitting devices which are stably seated in the cells and to emit lights having colors different from each other, wherein: among the semiconductor light-emitting devices, each of semiconductor light-emitting devices emitting lights of different colors include recess parts having different shapes on one surface thereof; and, the bottom surface of each of the cells includes solder parts protruding to correspond to the recess parts of each of the semiconductor light-emitting devices stably seated in the cells.