Light Emitting Module Ceramic Metal Support Heat Dissipation

Solution Overview

Problem

Conventional light emitting devices face challenges in heat dissipation, leading to reduced efficiency and reliability due to high thermal resistance and inadequate heat management.

Innovation Solution

A light emitting module is designed with a ceramic support member for the light emitting chip and a metal support member for control parts, utilizing a multi-layer structure with resin, ceramic, and metal materials to enhance heat dissipation, including a conductive layer and adhesive members for efficient thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a resin support member is used for the light emitting chip, then ease of manufacture and insulation are improved, but heat dissipation deteriorates due to high thermal resistance

Engineering Contradiction:

Improveease of manufactureVSAvoidheat dissipation

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The support structure is divided into two distinct members: a resin support member for insulation and ease of manufacture, and a ceramic support member for heat dissipation. This segmentation allows each material to perform its optimal function without compromise.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining resin and ceramic materials in separate support members. The resin member provides insulation and manufacturing ease, while the ceramic member provides thermal conductivity, creating a composite system that achieves both properties.

Inventive Principle:

Principle #40Composite materials

2Device complexity

If a single support member structure is used, then device complexity is reduced, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvedevice complexityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The support function is segmented into two separate members with distinct materials and functions. The resin support member handles insulation and structural support, while the ceramic support member handles heat dissipation, allowing optimized heat management without excessive complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the support structure have different material properties: the resin member provides insulation where needed, while the ceramic member provides thermal conductivity in the heat dissipation path. This local differentiation optimizes overall performance.

Inventive Principle:

Principle #3Local quality

3Temperature

If ceramic material is used for the support member, then heat dissipation is improved, but ease of manufacture and insulation deteriorate

Engineering Contradiction:

Improveheat dissipationVSAvoidease of manufacture

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The support structure is divided into two distinct members: a resin support member for insulation and ease of manufacture, and a ceramic support member for heat dissipation. This segmentation allows each material to perform its optimal function without compromise.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining resin and ceramic materials in separate support members. The resin member provides insulation and manufacturing ease, while the ceramic member provides thermal conductivity, creating a composite system that achieves both properties.

Inventive Principle:

Principle #40Composite materials

4Temperature

If thermal resistance is reduced, then heat dissipation is improved, but device complexity increases due to multi-layer structure

Engineering Contradiction:

Improvethermal resistanceVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The support function is segmented into two separate members with distinct materials and functions. The resin support member handles insulation and structural support, while the ceramic support member handles heat dissipation, allowing optimized heat management without excessive complexity.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves heat dissipation efficiency, reduces thermal resistance, and enhances the reliability of the light emitting device by using materials with high thermal conductivity and appropriate structural configurations.

Implementation Method 1

a second support member made of a ceramic material for insulation and heat dissipation of a light emitting chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a third support member made of a metal material for non-insulation and heat dissipation of control parts

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a second support member is adhered to an opening of a first support member using an adhesion layer

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS10811566B2Light emitting device, method for producing light emitting device, and light emitting module

Publication Date: 2020.10.20 SUZHOU LEKIN SEMICON CO LTD

AI summary

A light emitting module according to an embodiment comprises: a first support member having a first opening part and a second opening part; a second support member disposed in the first opening part in the first support member; a third support member disposed in the second opening part in the first support member; a first lead electrode disposed above the second support member; a second lead electrode disposed on the first support member and/or above the second support member; a light emitting chip disposed above the second support member and electrically connected to the first and second lead electrodes; a control component disposed above the third support member; and a conductive layer disposed underneath the first, second and third support members, wherein the first support member comprises a resin material, the second support material comprises a ceramic material and the third support member comprises a metal material.