LED Device Ceramic Substrate Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED devices face issues with increased cracking risk of silicone resin and reduced reflectivity due to high power density and heat, as well as brittleness of ceramic substrates, which affects lighting efficiency and chip arrangement density.
Innovation Solution
The LED device incorporates a ceramic substrate with an aluminum oxide-based composite material, a glass layer, and a dam structure to enhance reflectivity and thermal conductivity, while using a benzene ring-free silicone resin with phosphor for the encapsulated body to reduce cracking risk and improve light efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED device operates at high power density to increase light emitting efficiency, then light emitting efficiency is improved, but silicone resin ages or cracks due to increase in light and heat
Solution Approach 1:
A heat dissipation layer is introduced as an intermediary component between the LED chip and the silicone resin encapsulated body. This heat dissipation layer acts as a mediator to conduct away heat generated by high-power LED operation, preventing excessive heat from degrading the silicone resin while allowing the LED to operate at high power density for improved light emitting efficiency
Solution Approach 2:
The patent employs composite material structures including a multi-layer configuration with the heat dissipation layer integrated into the encapsulated body. This composite structure combines materials with different thermal and mechanical properties to simultaneously achieve high power density operation and resistance to resin cracking
2Use of energy by moving object
If LED device operates at high power density for extended period, then light emitting efficiency is improved, but risk of sulfurization of silver-containing circuit pattern is raised
Solution Approach 1:
A barrier layer is introduced as an intermediary protective component between the silver-containing circuit pattern and the external environment. This barrier layer prevents sulfur and other contaminants from reaching and reacting with the silver circuit pattern, eliminating the sulfurization issue while allowing the device to operate at high power density for improved light emitting efficiency
3Strength
If ceramic substrate is used in LED device, then structural support is provided, but ceramic substrate is easy to crack due to brittleness
Solution Approach 1:
The patent transitions from a monolithic ceramic substrate to a composite encapsulated body structure consisting of multiple layers including the heat dissipation layer and protective barrier layers. This composite structure maintains structural support while reducing brittleness and cracking risk through the combination of materials with complementary mechanical properties
4Productivity
If number of LED chips is increased to improve lighting efficiency, then lighting efficiency is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent employs a modular LED chip array configuration where multiple LED chips are systematically arranged and interconnected on the encapsulated body. This segmentation approach allows for increased chip density and improved lighting efficiency while maintaining manageable device complexity through standardized modular construction and systematic interconnection patterns
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a higher number of LED chips, improved reflectivity, and reduced cracking risk, enhancing lighting efficiency and reliability under high power density conditions, with optimized thermal management and contamination prevention.
Implementation Method 1
improved reflectivity of the ceramic substrate
Implementation Method 2
enhance reflectivity and thermal conductivity
Data Source
AI summary
A light emitting diode (LED) device includes: a substrate having a central portion; an LED chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the LED chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the LED chip unit.