Light Emitting Device Ceramic Support Thermal Stress Management
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Solution Overview
Problem
Conventional light emitting devices face challenges in heat dissipation and thermal stress management, which can reduce efficiency and reliability, particularly due to the direct transfer of thermal stress to the light emitting chip from lead electrodes.
Innovation Solution
A light emitting device design incorporating a ceramic support member under the light emitting chip, with a protection chip and lead electrodes separated to distribute thermal stress and improve heat dissipation, utilizing a reflective member for enhanced light extraction and a bonding member for efficient thermal conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead electrodes are directly connected under the light emitting chip, then electrical connection is achieved, but thermal stress is directly transferred to the light emitting chip causing reliability issues
Solution Approach 1:
A ceramic support member is introduced as an intermediary component between the light emitting chip and the lead electrodes. The ceramic material provides both mechanical support and thermal management, acting as a mediator that prevents direct thermal stress transfer from the metal lead electrodes to the sensitive light emitting chip while maintaining electrical connectivity through separate electrode paths.
Solution Approach 2:
The support structure is segmented into distinct functional layers: a ceramic support member for mechanical and thermal management, and separate lead electrodes for electrical connection. This segmentation allows each component to perform its specific function optimally without interfering with others, particularly isolating the light emitting chip from thermal stress while maintaining electrical pathways.
2Temperature
If heat dissipation structures are added to improve thermal management, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The ceramic support member serves multiple functions simultaneously: it provides mechanical support for the light emitting chip, acts as a thermal management component by conducting heat away from the chip, and serves as an electrical insulator separating the lead electrodes. This multi-functionality achieves effective heat dissipation without adding separate dedicated components, thereby avoiding increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal stress and improves heat dissipation efficiency, enhancing the reliability and light extraction of the light emitting device while maintaining a compact thickness.
Implementation Method 1
a first support member under the light emitting chip... the first support member includes a ceramic material between the second support member and the light emitting chip
Implementation Method 2
a reflective member disposed on a periphery of the light emitting chip
Data Source
AI summary
A light emitting device disclosed in an embodiment includes: a light emitting chip including a light emitting part, including a plurality of semiconductor layers, and a first electrode and a second electrode under the light emitting part; a first support member under the light emitting chip; a second support member under the first support member; a first lead electrode connected to the first electrode and a second lead electrode connected to the second electrode, in the second support member, the first lead electrode being separated from the second lead electrode; a protection chip disposed between the first and second lead electrodes; and a reflective member disposed on a periphery of the light emitting chip, wherein the first support member includes a ceramic material between the second support member and the light emitting chip.