LED Chip Alignment via Segmented Vacuum Fixation
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Solution Overview
Problem
The miniaturization of LED chips has made precise alignment challenging, leading to increased failure rates and longer transfer times during the manufacturing of LED display panels.
Innovation Solution
A light source module with a substrate featuring a black matrix and holes corresponding to chip mounting areas, allowing semiconductor light emitting devices to be precisely and quickly positioned using a vacuum chuck, ensuring accurate electrical coupling with connection pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If LED chips are miniaturized to reduce display apparatus size, then the display apparatus can be more compact, but alignment precision deteriorates leading to increased failure rates and longer transfer times
Solution Approach 1:
The invention introduces a fixation pattern divided into multiple fixation areas on the substrate, with each area containing multiple fixation holes. This segmentation allows the vacuum chuck to grip multiple discrete points on the LED chip simultaneously, providing stable positioning even for miniaturized chips. The patterned structure breaks down the alignment task into manageable zones, each contributing to overall positioning accuracy.
Solution Approach 2:
The fixation pattern is pre-formed on the substrate before LED chip mounting. This preliminary structure provides ready-made alignment references and vacuum grip points, eliminating the need for complex real-time alignment adjustments during the transfer process. The pre-configured holes and patterns guide the LED chip placement, ensuring consistent positioning accuracy.
2Volume of moving object
If LED chips are miniaturized, then display compactness is improved, but transfer time increases due to alignment difficulties
Solution Approach 1:
By dividing the fixation pattern into multiple areas with multiple holes each, the system can grip miniaturized LED chips at multiple points simultaneously. This segmented approach eliminates the need for sequential alignment adjustments, allowing faster transfer of small chips without sacrificing precision.
Solution Approach 2:
The fixation pattern with its predetermined holes and areas enables the LED chip to self-align during placement. The vacuum chuck simply needs to apply suction through the predefined holes, and the chip automatically positions itself relative to the substrate, eliminating complex alignment procedures and reducing transfer time.
3Productivity
If a vacuum chuck is used to move LED chips, then transfer speed is improved, but alignment precision may deteriorate without proper fixation structures
Solution Approach 1:
The fixation pattern segments the gripping function into multiple discrete holes distributed across different fixation areas. This allows the vacuum chuck to apply force at multiple points simultaneously, maintaining both speed and precision. The segmented structure prevents chip slippage or misalignment that could occur with single-point gripping.
Solution Approach 2:
The fixation pattern acts as an intermediary structure between the vacuum chuck and the LED chip. Rather than the vacuum chuck directly gripping the chip (which could cause misalignment), the predefined holes serve as intermediate contact points that guide and stabilize the chip during transfer, ensuring both speed and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise and efficient alignment of LED chips, reducing failure rates and transfer times, thereby improving the manufacturing efficiency of LED display panels.
Implementation Method 1
a scheme of precisely and quickly moving a small sized chip through a vacuum chuck
Data Source
AI summary
A display apparatus may include a light source module that may include a substrate having a plurality of chip mounting areas of which each has a connection pad disposed therein, and a plurality of semiconductor light emitting devices electrically coupled to separate connection pads. The display apparatus may include a black matrix on the substrate and having a plurality of holes corresponding to the pattern of chip mounting areas. The semiconductor light emitting devices may be in separate, respective holes to be electrically coupled to separate connection pads. The display apparatus may include unit pixels, where each unit pixel includes multiple adjacent semiconductor light emitting devices. The semiconductor light emitting devices may be removably coupled to separate connection pads, and a semiconductor light emitting device may be interchangeably swapped from a connection pad.