LED Chip Bonded to Substrate with Etched Isolation
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Solution Overview
Problem
Conventional semiconductor devices with LED chips face challenges in reducing chip width and material costs due to the large surface area of electrode pads, which hinders efficient electrical connection and light emission.
Innovation Solution
A semiconductor device featuring a semiconductor thin film with discrete operating regions and an element isolating region, where the thin film is bonded to a substrate, eliminating the need for electrode pads by using discrete interconnection layers and a metal layer for electrical connection, thereby reducing material costs and enhancing light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrode pads are provided on LED chip, then electrical connection is ensured, but chip width and material cost cannot be reduced
Solution Approach 1:
The invention extracts and eliminates the electrode pads from the LED chip structure. Instead of using traditional electrode pads on the LED chip, the patent uses the substrate's electrode pads directly, removing the unnecessary intermediate component and reducing both material cost and chip width.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the mounting base for the LED chip and as the carrier of electrode pads for electrical connection. This multi-functionality eliminates the need for separate electrode pads on the LED chip itself, reducing overall structure complexity and material usage.
2Ease of manufacture
If electrode pads are provided on LED chip, then electrical connection is ensured, but light emission efficiency is reduced
Solution Approach 1:
By removing the electrode pads from the LED chip surface, the invention eliminates the non-light-emitting areas that waste space and potentially interfere with light emission. The light-emitting regions can now extend to the edges of the chip without being interrupted by electrode pad structures.
Solution Approach 2:
The invention applies different functional zones more efficiently: the substrate provides the electrical connection function through its electrode pads, while the LED chip surface is dedicated entirely to light emission. This separation of functions optimizes each region for its specific purpose, improving overall light emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for significant material cost savings, improved electrical properties, and enhanced light emission efficiency by reducing the surface area of the LED epitaxial film while maintaining contact area and adhesion strength, leading to a more compact and cost-effective LED print head and image-forming apparatus.
Implementation Method 1
bonding the semiconductor thin film which has been separated from the first substrate to a second substrate
Implementation Method 2
forming an element isolating region by etching a region other than the plurality of discrete operating regions of the semiconductor thin film bonded to the second substrate
Data Source
AI summary
A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an element isolating region which isolates the plurality of discrete operating regions, and the element isolating region is etched to a shallower depth than a thickness of the semiconductor thin film, and is a thinner region than the plurality of discrete operating regions.