Light Emitting Device Chip Carrier Height Optimization

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Solution Overview

Problem

Conventional light-emitting diode (LED) apparatuses face challenges in maximizing light extraction efficiency and heat dissipation due to total reflection at the interface between the transparent encapsulating material and ambient surroundings, as well as difficulties in dissipating heat through the reflecting cup.

Innovation Solution

A light-emitting apparatus is designed with a chip carrier formed between the LED chip and the submount, featuring a reflecting cup that encloses both, and a transparent encapsulating material that only covers the LED chip, along with a reflecting layer using materials like silver, aluminum, or silicon oxide for improved light redirection and heat conduction using high thermal conductivity materials like silicon or copper.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the transparent encapsulating material fills the whole cavity formed by the reflecting cup, then the LED chip is fully protected, but total reflection at the interface between the encapsulating material and ambient surroundings reduces light extraction efficiency

Engineering Contradiction:

Improveprotection of LED chipVSAvoidlight extraction efficiency

Core Design Contradiction:

ReliabilityVSIllumination intensity

Solution Approach 1:

The patent divides the encapsulation space into two regions: a first transparent encapsulating material filling the cavity formed by the reflecting cup for protection, and a second transparent encapsulating material filling the space above the first material that allows light transmission. This segmentation resolves the contradiction by providing both protection and light extraction efficiency through differentiated material placement.

Inventive Principle:

Principle #1Segmentation

2Illumination intensity

If the reflecting cup encloses the LED chip, then light is redirected directionally, but heat dissipation becomes difficult

Engineering Contradiction:

Improvedirectional light beamVSAvoidheat dissipation

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation member as an intermediary component positioned between the LED chip and the reflecting cup. This member provides a thermal conduction path for heat dissipation while allowing the reflecting cup to maintain its light redirecting function, thus resolving the contradiction between directional light output and heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If spaces are formed between the reflecting cup and cup supporter for disposing peripheral electronic elements, then device functionality is enhanced, but heat dissipation pathways are blocked

Engineering Contradiction:

Improvedisposal of peripheral electronic elementsVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent designs the reflecting cup structure to serve multiple functions: it provides light reflection, structural support, and thermal management. The cup supporter is configured to provide both mechanical support and maintain thermal pathways, allowing peripheral electronic elements to be disposed in the spaces without blocking heat dissipation routes.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Illumination intensity

If the chip carrier height is increased to optimize light extraction, then light extraction efficiency improves, but the overall device height increases

Engineering Contradiction:

Improvelight extraction efficiencyVSAvoiddevice height

Core Design Contradiction:

Illumination intensityVSLength of stationary object

Solution Approach 1:

The patent optimizes the chip carrier height as a critical parameter within a specific range to achieve optimal light extraction efficiency. By precisely controlling this dimensional parameter and coordinating it with the reflecting cup height ratio, the design achieves high light extraction efficiency while maintaining a compact overall device height.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances light extraction efficiency by controlling the chip carrier height and heat dissipation, optimizing the dimensions and materials to achieve a directional light beam and efficient thermal management.

Implementation Method 1

The reflecting cup 12 redirects the light emitted from the LED chip 13 upwardly to form a directional light beam

Methodology Applied

Scientific EffectReflection: Reflection

Implementation Method 2

part of the light is not able to transmit through the transparent encapsulating material 14 due to the total reflection at the interface between the transparent encapsulating material 14 and the ambient surroundings

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 3

heat conduction using high thermal conductivity materials like silicon or copper

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9553243B2Light emitting device

Publication Date: 2017.01.24 ENNOSTAR CORP

AI summary

This disclosure relates to a light-emitting apparatus comprising a submount, a chip carrier formed on the submount, a light-emitting chip formed on the chip carrier, a reflecting cup formed on the submount and enclosing the light-emitting chip and the chip carrier, and a transparent encapsulating material for encapsulating the light-emitting chip.