LED Package Chip Classification via Rotary Suction and Optical Testing
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Solution Overview
Problem
As semiconductor devices shrink and circuit integration increases, small particles and defects become more critical, affecting the reliability and yield of semiconductor fabrication processes, necessitating effective classification systems for LED package chips.
Innovation Solution
An LED package chip classification system comprising a rotation unit, chip test unit, and classification unit, utilizing rotary turntables, suction-exhaust openings, chip test modules, and light-based detection systems to classify and position LED package chips based on their luminescent properties, ensuring accurate sorting and breakaway detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple tests are performed continuously to find the root cause of defects, then the reliability of semiconductor devices is improved, but the loss of time and productivity decrease
Solution Approach 1:
The patent implements preliminary classification of LED package chips based on their luminescent properties before final testing. By pre-sorting chips into different groups using optical detection and rotary classification mechanisms, the system identifies and separates defective or suboptimal chips early in the process, reducing the need for extensive subsequent testing on every chip and thereby decreasing overall testing time while maintaining reliability.
Solution Approach 2:
The patent replaces traditional mechanical and manual testing methods with optical detection systems and automated classification mechanisms. Using light-based detection to assess luminescent properties and automated rotary turntables for classification eliminates time-consuming manual inspection and enables parallel processing of multiple chips, significantly reducing testing time while improving reliability through consistent automated evaluation.
2Productivity
If device size shrinks and circuit integration increases, then the functionality and density are improved, but the impact of small particles and defects on reliability worsens
Solution Approach 1:
The system performs preliminary optical detection and classification of LED package chips before they are integrated into larger assemblies. By detecting luminescent properties and identifying potential defects early in the process, the system prevents defective chips from proceeding to integration, ensuring high reliability in the final product while maintaining high integration density.
Solution Approach 2:
The patent implements a feedback mechanism where optical detection results are used to automatically classify and sort chips in real-time. The detection system provides immediate feedback on chip quality based on luminescent properties, enabling the classification system to adjust and separate defective chips from合格 chips, thereby maintaining high reliability even as device size shrinks and integration increases.
3Productivity
If automated classification and testing systems are implemented, then productivity and sorting accuracy are improved, but device complexity increases
Solution Approach 1:
The patent divides the chip classification system into multiple functional modules: optical detection units, classification control units, and separate classification paths for different chip types. Each module performs a specific function, allowing the complex overall system to be managed through modular components that can be independently optimized and maintained, thereby reducing operational complexity despite high productivity.
Solution Approach 2:
The patent designs a universal classification system that can handle multiple types of LED package chips using the same basic optical detection and classification mechanism. By creating a multi-functional system that adapts to different chip types through software control rather than requiring entirely separate hardware systems, the patent achieves high productivity while managing device complexity through standardization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances the reliability and yield of semiconductor fabrication by effectively classifying LED package chips, reducing defects, and improving the precision of process parameters through precise testing and sorting mechanisms.
Implementation Method 1
a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions, each receiving portion selectively receives at least one of the LED package chips
Implementation Method 2
a chip position detection unit including a light emitting element disposed above the receiving portion and adjacent to the at least one transportation element and a chip position detection element disposed under the receiving portion and corresponding to the light emitting element, wherein light beams generated by the light emitting element are selectively projected onto the top surface of the LED package chip or transmitted to the chip position detection element
Implementation Method 3
a chip test unit includes at least one chip test module adjacent to the rotation unit for testing each LED package chip
Data Source
AI summary
An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.