LED Chip Cluster Optics for Uniform Long-Distance Projection
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Solution Overview
Problem
Existing LED lights with individually encapsulated LED chips in separate lamp beads do not fully utilize the lens area, leading to limitations in luminous efficacy and long-distance performance, making it challenging to optimize lighting performance.
Innovation Solution
An LED light-emitting structure with chip clusters containing multiple types of LED chips arranged in arrays, staggered or circular configurations, and covered by optical elements, where chip clusters are positioned to complement each other's light effects, enhancing reflection area and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If individual LED chips are independently encapsulated within separate lamp beads, then each chip can be independently controlled and replaced, but the lens area is not fully utilized, resulting in limited luminous efficacy and long-distance performance
Solution Approach 1:
Multiple LED chips are merged into a single lamp bead to form a chip cluster, allowing the lens to fully cover and utilize the entire cluster. This combining approach maximizes the lens area utilization while maintaining independent control through separate electrical connections to each chip in the cluster.
Solution Approach 2:
The patent transitions from a single-chip three-dimensional encapsulation to a multi-chip planar array configuration within the lamp bead. This dimensional change allows multiple chips to be arranged in a two-dimensional pattern that can be fully covered by the lens, increasing the effective light-emitting area and improving luminous efficacy.
2Ease of manufacture
If individual LED chips are independently encapsulated within separate lamp beads, then manufacturing is simplified, but long-distance light projection and light distribution uniformity are restricted
Solution Approach 1:
Different LED chips within the same lamp bead can have different luminous characteristics (different colors, intensities, or beam angles). By strategically selecting and arranging chips with complementary properties, the overall light output achieves improved uniformity and extended projection distance while maintaining manufacturing simplicity.
3Illumination intensity
If multiple LED chips are arranged in chip clusters covered by optical elements, then total reflection area and long-distance projection are improved, but the structural complexity increases
Solution Approach 1:
The lamp bead is segmented into multiple functional zones corresponding to different LED chip positions within the cluster. Each chip can be independently controlled and optimized for specific functions (e.g., center chips for primary beam, edge chips for flood illumination), allowing complex lighting patterns to be achieved through simple individual chip control without increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration improves long-distance projection and uniformity of light emission by increasing the total reflection area, optimizing lighting performance through coordinated light compensation among different LED chips.
Implementation Method 1
the principle of total internal reflection plays a crucial role in determining the luminous efficacy, where a larger reflection area leads to better long-distance light projection
Implementation Method 2
When voltage is applied to both terminals, the total minority carriers and majority carriers of the semiconductor recombine to release excess energy and emit photon, thereby emitting light directly
Data Source
AI summary
An LED light-emitting structure, a light-emitting device, and a preparation method for light-emitting structure. The LED light-emitting structure includes: a base, a conductive portion is arranged on one side of the base; a chip cluster, the chip cluster comprises a plurality of LED chips, the plurality of LED chips include at least two types and are fixedly arranged on another side of the base and connected to the conductive portion; a plurality of the chip clusters are arranged on the base, and the positions of the LED chips in adjacent chip clusters correspond to each other; an optical element, the optical element is arranged to cover a side of the base corresponding to the chip cluster. When in use, different LED chips within the chip clusters can work together to provide light compensation, increasing a total reflection area of the optical elements.