LED Chip Cover Secondary Optics for Low-Loss Light Coupling
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Solution Overview
Problem
Existing chip covers for LEDs suffer from inefficiencies in optical emission due to imperfect coupling with secondary optics, leading to light loss and large luminaire designs, as the optical emission properties are primarily determined by the material used in the lens.
Innovation Solution
Integrating secondary optics directly into the chip cover structures or onto the surface of LEDs, allowing for improved coupling and potentially eliminating the need for conventional secondary optics by designing the integrated secondary optic to alter the emission profile of the LED package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional secondary optic is coupled to the LED package, then the desired emission pattern can be achieved, but light loss occurs due to imperfect coupling
Solution Approach 1:
The patent merges the secondary optic functionality directly into the chip cover structure by integrating an optical element onto the chip cover. This combination eliminates the separate coupling interface between LED package and secondary optic, thereby removing light loss due to imperfect coupling while maintaining the desired emission pattern.
2Volume of moving object
If a conventional secondary optic is used with LED package, then directionality can be achieved, but the luminaire design becomes large
Solution Approach 1:
By integrating the secondary optic functionality into the chip cover, the patent eliminates the need for a separate large secondary optic component. The optical element is formed directly on the chip cover surface, maintaining directionality control while significantly reducing the overall luminaire volume.
3Adaptability or versatility
If the optical emission properties are determined by the lens material, then manufacturing is simplified, but the emission profile control is limited
Solution Approach 1:
The patent applies local quality by creating specific optical features (such as microlenses, gratings, or other optical patterns) at localized positions on the chip cover surface. This allows different regions of the chip cover to have different optical properties, enabling precise control of the emission profile while using standard lens materials.
Solution Approach 2:
The patent replaces the traditional approach of controlling emission profile through bulk lens material properties with a surface-level optical element that uses geometric or diffractive optics. This substitution allows for programmable emission patterns without changing the fundamental lens material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency of the final luminaire by improving light coupling and allowing for tailored optical emission profiles, reducing light loss and simplifying luminaire designs.
Implementation Method 1
an optical element is integrated as a secondary optic onto one or both surfaces of a chip cover structure... The integrated secondary optic is purposely built to be coupled with the light emission of the LED to emit the desired optical profile
Data Source
AI summary
Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly integrated secondary optics into LED chip cover structures for improved optical emission of high intensity LEDs is disclosed. Optical elements are integrated as a secondary optic onto one or both surfaces of a chip cover structure, where the chip cover structure may be referred to as a primary optic. The integrated secondary optic may be formed directly on one or both surfaces of the chip cover structure. The integrated secondary optic is purposely built to be coupled with the light emission of the LED to emit a desired emission profile. In this regard, a final luminaire may be provided with increased efficiency either by improving the coupling of the LED into a conventional secondary optic or in some cases by removing the need for a conventional secondary optic all together.