LED Chip Dummy Electrode Laser Bonding Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional pick and place processes for attaching LED chips to substrates often result in misalignment, increasing manufacturing costs and time, and reducing yield, especially in smaller display devices like smartphones and virtual reality headsets.
Innovation Solution
The use of dummy electrodes on LED chips, which are bonded to the substrate using a laser, providing additional contact points for improved attachment and alignment before permanently securing the LEDs, allowing for testing of LED operability and reducing misalignment issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional pick and place process is used to attach LED chip to substrate, then manufacturing process is simple, but misalignment occurs increasing cost and manufacturing time
Solution Approach 1:
The patent applies preliminary action by bonding dummy electrodes to substrate contacts before performing LED chip alignment and testing. This preliminary bonding establishes reference points that facilitate precise alignment during subsequent steps, preventing misalignment issues that would require reattachment and additional manufacturing time.
2Manufacturing precision
If conventional pick and place process is used to attach LED chip to substrate, then manufacturing process is simple, but misalignment occurs increasing cost
Solution Approach 1:
The patent applies segmentation by dividing the bonding process into distinct phases: first bonding dummy electrodes to substrate contacts, then separately bonding LED chip electrodes to substrate contacts. This segmentation allows each bonding operation to be optimized independently, improving alignment precision while maintaining manufacturing feasibility through modular process steps.
3Reliability
If LED chip is bonded directly to substrate, then manufacturing process is fast, but LED operability cannot be tested before permanent attachment
Solution Approach 1:
The patent uses dummy electrodes as intermediaries between the LED chip and substrate. These dummy electrodes are bonded first and serve as stable reference points that remain during LED operability testing. This intermediary structure enables reliability verification without compromising manufacturing throughput, as the dummy electrodes provide a fixed reference framework for subsequent operations.
4Manufacturing precision
If LED chip becomes misaligned during bonding, then additional reattachment steps are needed, but this reduces yield
Solution Approach 1:
The patent performs preliminary bonding of dummy electrodes to substrate contacts before LED chip attachment. This preliminary action creates stable reference points that guide subsequent LED chip alignment, significantly reducing misalignment occurrences that would lead to discarding chips and reducing manufacturing yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the attachment strength between the LED chip and substrate, reduces manufacturing time and costs, and improves yield by allowing for pre-testing of LEDs before final bonding, minimizing waste and ensuring proper alignment.
Implementation Method 1
Laser beams are applied to the dummy electrodes or the corresponding contacts to attach the LED chip to the substrate
Data Source
AI summary
A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes one or more dummy electrodes that corresponds to one or more contacts on the substrate. The one or more dummy electrodes are exposed to a laser beam for coupling the one or more dummy electrodes to the one or more contacts. The one or more dummy electrodes may be positioned along edges of the LED chip that surround a display area of the LED chip and provide bonding strength between the LED chip and the substrate.