LED Chip Electrode Extension Layout for Uniform Current Spreading
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Solution Overview
Problem
Conventional LED technology faces challenges in maximizing light emission efficiency due to limitations in current spreading and light extraction, particularly for larger area LEDs, which affects the uniformity of electrostatic field strength and recombination efficiency.
Innovation Solution
The formation of electrode extensions and vias on opposing sides of the active LED structure, with specific shapes and spacings to enhance recombination efficiency and uniformity of electrostatic field strength, thereby improving light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional electrode layouts are used in larger area LEDs, then current spreading is limited, but light extraction efficiency and emission intensity are reduced
Solution Approach 1:
The electrode structure is segmented into multiple components: electrode extensions with fingers that distribute current across the LED surface, and multiple vias that provide current pathways. This segmentation allows current to spread more effectively across larger LED areas, improving light extraction efficiency without requiring a single complex electrode design
Solution Approach 2:
The electrode extensions are positioned at specific distances from the vias, creating a three-dimensional current distribution pattern. By controlling the lateral spacing between electrode extensions and vias, the patent optimizes current spreading in multiple dimensions, enhancing light extraction while maintaining manageable electrode layout complexity
2Productivity
If electrode extensions are positioned close to vias, then current distribution is improved, but electrostatic field strength uniformity is compromised
Solution Approach 1:
The patent applies different spatial relationships between electrode extensions and vias in different regions of the LED. By controlling the lateral distance locally, the design optimizes current spreading in high-density regions while maintaining electrostatic field uniformity in regions where extensions are laterally spaced from vias, creating locally optimized conditions throughout the device
Solution Approach 2:
The lateral spacing parameter between electrode extensions and vias is carefully controlled and optimized. By adjusting this geometric parameter, the patent achieves the optimal balance between current spreading efficiency and electrostatic field uniformity, with extensions positioned at distances that enhance current distribution while preventing field concentration anomalies
3Power
If larger area LEDs are used to increase light output, then emission intensity increases, but current spreading limitations reduce extraction efficiency
Solution Approach 1:
The multi-component electrode structure with extensions and multiple vias segments the current path, enabling effective current spreading across larger LED active regions. This allows larger area LEDs to maintain high extraction efficiency by distributing current through multiple pathways rather than relying on a single electrode, thus increasing total light output without proportional efficiency loss
Solution Approach 2:
The patent utilizes vertical stacking of multiple vias and lateral extension of electrode fingers to create a multi-dimensional current distribution network. This approach enables larger area LEDs to overcome current spreading limitations by providing current pathways in multiple spatial dimensions, maintaining extraction efficiency while scaling up light output capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed layout of electrode extensions and vias increases the emission efficiency of LED chips by optimizing current distribution and electrostatic field strength, leading to enhanced light output.
Implementation Method 1
When a bias is applied across the doped layers, holes and electrons are injected into the one or more active layers where they recombine to generate emissions such as visible light or ultraviolet emissions
Implementation Method 2
Electrodes for the LEDs can have larger surface areas and may include various electrode extensions or fingers that are configured to route and distribute current across an LED
Implementation Method 3
Recombination efficiency is higher in regions between electrode extensions and closest vias where higher electrostatic field strength is exhibited
Data Source
AI summary
Solid-state lighting devices including light-emitting diode (LED) chips and more particularly LED chip structures with electrode extensions and vias are disclosed. Electrode extensions and vias are formed on opposing sides of an active LED structure as part of anode and cathode connections. Electrode extensions are formed with various shapes in positions relative to closest vias to promote improved recombination efficiency in active LED structures. Recombination efficiency is higher in regions between electrode extensions and closest vias where higher electrostatic field strength is exhibited. Layouts of vias relative to electrode extensions are disclosed with improved uniformity in spacings relative to areas of higher electrostatic field strength to increase emission efficiency of LED chips.