LED Chip Electrostatic Conducting Layer ESD Protection
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Solution Overview
Problem
Conventional LED chips require additional semiconductor substrates and complex diode structures to prevent electrostatic discharge damage, increasing production costs and yield issues due to deep via holes and long conductive wires that affect reliability and brightness.
Innovation Solution
An LED chip with an electrostatic conducting layer between the substrate and doped semiconductor layers, utilizing Schottky contact electrodes and conductive wires to direct static charges away from the LED, simplifying the structure and fabrication process while maintaining high reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an extra diode is added to prevent electrostatic discharge damage, then the LED is protected from ESD damage, but the production cost increases due to additional substrates and welding processes
Solution Approach 1:
The patent combines the ESD protection function with the LED chip substrate by forming an electrostatic conducting layer directly on the substrate. This merges the protection function into the existing structure, eliminating the need for separate diode components and reducing overall device complexity while maintaining ESD protection capability.
Solution Approach 2:
The substrate is given multiple functions: it serves as both the mechanical support for the LED structure and as the electrostatic discharge protection component through the conducting layer. This multi-functionality eliminates the need for dedicated ESD protection components, simplifying the overall device structure.
2Reliability
If deep via holes are created to connect electrodes, then electrical connection is achieved, but manufacturing precision and yield deteriorate due to fabrication difficulties
Solution Approach 1:
Instead of creating deep via holes through the substrate to achieve electrical connection, the patent inverts the approach by forming the electrostatic conducting layer on the substrate surface and making connections through the top surface. This eliminates the need for deep via hole fabrication, significantly improving manufacturing precision and yield.
3Reliability
If long conductive wires are used to connect electrodes, then electrical connection is achieved, but reliability deteriorates due to excessive wire length
Solution Approach 1:
The patent merges the electrical connection function with the substrate structure itself through the electrostatic conducting layer. This eliminates the need for separate long conductive wires, reducing device complexity and improving reliability by minimizing wire length and associated failure points.
4Reliability
If additional substrates are used for diode fabrication, then ESD protection is achieved, but production cost increases
Solution Approach 1:
The single substrate serves dual purposes: supporting the LED structure and providing ESD protection through the electrostatic conducting layer. This eliminates the need for additional substrates for diode fabrication, directly reducing production costs while maintaining ESD protection functionality.
Solution Approach 2:
The patent combines the ESD protection function into the LED chip substrate itself, merging what would traditionally require separate components into a single integrated structure. This reduces the total number of substrates needed, simplifying manufacturing and reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The LED chip effectively protects against electrostatic discharge with a simpler structure, easier fabrication, and improved reliability by using an electrostatic conducting layer to expel static charges, reducing the need for additional substrates and long conductive wires.
Implementation Method 1
utilizing Schottky contact electrodes and conductive wires to direct static charges away from the LED
Data Source
AI summary
A light-emitting diode chip (LED chip) including a substrate, an electrostatic conducting layer, a first type doped semiconductor layer, an active layer, a second type doped semiconductor layer, a first electrode and a second electrode is provided. The electrostatic conducting layer is disposed on the substrate, while the first type doped semiconductor layer is disposed on a partial area of the electrostatic conducting layer. Besides, the active layer is disposed on a partial area of the first type doped semiconductor layer, while the second type doped semiconductor layer is disposed on the active layer. In addition, the first electrode is disposed on the first type doped semiconductor layer, while the second electrode is disposed on the second type doped semiconductor layer. The LED chip of the present invention has an electrostatic conducting layer, which protects the LED from electrostatic discharge damage (ESD damage).