LED Display Chip-on-Film Integration for Narrow-Bezel Tiling
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Solution Overview
Problem
The existing chip on film package structure for LED display devices is costly, and there is a need to reduce the border size and seam of tiled display devices.
Innovation Solution
The integration of multiple chips into a single chip on film package structure, with staggered and interlaced signal and power bumps, reduces the number of separate chip on film package structures, minimizing the border size and seam of the LED display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate chip on film package structures are used to control different signal types, then the display device achieves precise control of light-emitting signals, gate signals, data signals, and reset signals, but the border size and seam of tiled display devices increase and manufacturing cost increases
Solution Approach 1:
The patent combines multiple separate chip on film package structures into a single integrated chip on film package structure that controls all signal types (light-emitting signals, gate signals, data signals, and reset signals). This merging approach reduces the number of separate packages from multiple to one, thereby minimizing the border size and seam in tiled display devices while maintaining precise control of all signal types through the integrated structure.
2Reliability
If multiple separate chip on film package structures are used, then each chip can be optimized for specific signal control, but the quantity and cost of chip on film package structures increases
Solution Approach 1:
The patent merges multiple separate chip on film package structures into one integrated structure that handles all signal types simultaneously. This reduces the quantity of chip on film package structures from multiple separate units to a single unit, thereby lowering manufacturing costs and material usage while maintaining the precision needed for controlling different signal types through the integrated design.
3Adaptability or versatility
If multiple separate chip on film package structures are used, then comprehensive signal control is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple separate chip on film package structures into a single integrated chip on film package structure that provides comprehensive signal control capability for all signal types. This merging reduces manufacturing complexity by eliminating the need to manufacture, handle, and assemble multiple separate structures, thereby reducing manufacturing costs while maintaining the versatility needed for comprehensive signal control.
Data Source
AI summary
A light-emitting diode (LED) display device includes an LED display panel and a first chip on film package structure. The first chip on film package structure is bonded to the LED display panel and includes a first chip, a second chip and a first circuit board. The first chip includes first signal output bumps and first dummy bumps. The second chip includes second signal output bumps. First signal output lines are electrically connected to the first signal output bumps respectively. Second signal output lines are electrically connected to the second signal output bumps respectively. At least part of the second signal output lines are electrically connected to the first dummy bumps respectively. One of the first chip and the second chip is a light-emitting signal control chip.