LED Chip Series Connection via Insulating Connector

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Solution Overview

Problem

Existing light-emitting diode chips have a limited lifetime due to poor thermal conductivity and potential short circuits, which hinder efficient heat dissipation and reliability.

Innovation Solution

The design incorporates semiconductor bodies with an electrically insulating connector that provides mechanical and electrical isolation between the semiconductor bodies and a carrier, allowing for series connection while minimizing thermal conductivity issues through the use of thin insulating layers and ensuring robust mechanical contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an electrically insulating connector is introduced to prevent short circuits and provide mechanical contact, then reliability is improved, but thermal conductivity deteriorates due to the insulating material

Engineering Contradiction:

Improveshort circuit preventionVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent introduces an electrically insulating layer as an intermediary component between the semiconductor bodies and the carrier. This thin insulating layer serves as a mediator that provides electrical insulation to prevent short circuits while maintaining sufficient thermal conduction for heat dissipation, thus resolving the contradiction between reliability and temperature management

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies different materials with different properties to different regions: the electrically insulating connector provides electrical insulation where needed, while the thin insulating layer maintains local thermal conduction pathways. This local differentiation of material properties allows simultaneous achievement of electrical isolation and thermal management

Inventive Principle:

Principle #3Local quality

2Use of energy by moving object

If semiconductor bodies are connected in series to increase operating voltage and efficiency, then energy conversion efficiency is improved, but device complexity increases due to additional connection requirements

Engineering Contradiction:

Improveenergy conversion efficiencyVSAvoidconnection structure

Core Design Contradiction:

Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into the electrically insulating connector: it provides mechanical contact, electrical insulation, and structural support for series connections. By merging these functions into a single component, the patent achieves series connection of semiconductor bodies for improved energy efficiency without proportionally increasing device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrically insulating connector serves multiple purposes simultaneously: it acts as a mechanical support structure, provides electrical insulation to prevent short circuits, and enables series electrical connection of semiconductor bodies. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If a thin electrically insulating layer is used to maintain thermal conduction, then heat dissipation is improved, but manufacturing precision requirements increase to ensure proper insulation and contact

Engineering Contradiction:

Improvethermal conductionVSAvoidlayer thickness control

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent optimizes the thickness parameter of the electrically insulating layer to a specific range that balances electrical insulation and thermal conduction. By carefully selecting and controlling this parameter, the patent achieves sufficient thermal conduction while maintaining adequate electrical insulation, managing the manufacturing precision requirements through parameter optimization

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the light-emitting diode chip's efficiency, prevents short circuits, and improves heat dissipation, leading to increased reliability and extended lifetime by maintaining mechanical and electrical stability.

Implementation Method 1

the electrically insulating connector imparts a mechanical contact between the semiconductor bodies and the carrier

Methodology Applied

Scientific EffectMechanical contact:

Implementation Method 2

each semiconductor body including at least one active region that generates radiation

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 3

an electrically insulating layer arranged between the electrically insulating connector and the top side of the carrier

Methodology Applied

Scientific EffectElectrical insulation:

Data Source

PatentUS9548433B2Light-emitting diode chip

Publication Date: 2017.01.17 OSRAM OLED

AI summary

A light-emitting diode chip includes at least two semiconductor bodies, each semiconductor body including at least one active area that generates radiation, a carrier having a top side and an underside facing away from the top side, and an electrically insulating connector arranged at the top side of the carrier, wherein the electrically insulating connector is arranged between the semiconductor bodies and the top side of the carrier, the electrically insulating connector imparts a mechanical contact between the semiconductor bodies and the carrier, and at least some of the semiconductor bodies electrically connect in series with one another.