LED Chip Interconnect Layout for Uniform Current Spreading

The LED chip is divided into multiple segments including a mesa structure, reflective layer, and multiple interconnects. The mesa segregates the active region from the substrate, while the reflective layer segments the bottom surface to redirect light. This segmentation allows light that would otherwise be lost through internal reflection to be redirected and extracted, improving light extraction efficiency without significantly complicating manufacturing processes.

A reflective layer is introduced as an intermediary between the active region and the substrate. This reflective layer acts as a mediator that captures light directed toward the substrate and redirects it toward the light extraction surface. The interconnects also serve as intermediaries that provide both electrical connection and light reflection pathways, thereby improving light extraction efficiency while maintaining manufacturing feasibility.

The interconnects are designed with varying local properties including different diameters and spacing arrangements. Interconnects closer to the mesa have different characteristics than those farther away, with diameters and spacing optimized for their specific positions. This local quality variation ensures uniform current distribution across the LED chip surface, preventing current crowding while maintaining manageable device complexity.

The interconnect arrangement employs asymmetric patterns where interconnects are not uniformly distributed but rather positioned according to specific geometric relationships with the mesa structure. This asymmetric arrangement, combined with varying interconnect diameters, creates optimal current pathways that spread current uniformly across the chip, improving reliability without requiring overly complex symmetric patterns.

The LED chip structure is segmented into a central mesa and multiple surrounding interconnects arranged in geometric patterns. This segmentation allows the active region to be distributed across multiple smaller emission zones rather than one large zone, enabling better current control and spreading across the entire chip area. This maintains high luminous flux while preventing current crowding that would reduce efficiency in larger area LEDs.

The interconnect parameters including diameter, spacing, and arrangement pattern are specifically optimized for larger area LEDs. By adjusting these parameters, the current density distribution is controlled to maintain uniform spreading across the expanded chip area, ensuring that luminous flux increases without proportionally increasing current crowding losses.