LED Chip Package With Microlens Array for Directional Light Output

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing LED chips predominantly emit light with a Lambertian distribution, necessitating large-scale secondary optics to convert wide-angle light beams into highly directional beams, which increases system volume and complexity.

Innovation Solution

A chip package integrating a light-emitting diode chip with a reflective layer and a microlens layer, where the microlenses are arranged in an array to optimize light emission into a highly directional beam, reducing the need for secondary optical elements and miniaturizing the system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If large-scale lenses are used to couple wide-angle light beams into the optical system, then the light coupling efficiency is improved, but the volume and complexity of the optical system increases

Engineering Contradiction:
Improveoptical coupling efficiencyVSAvoidoptical system volume
Core Design Contradiction:
Loss of energyVSVolume of stationary object

Solution Approach 1:

The patent divides the single large lens into multiple microlenses arranged in an array on the light-emitting chip. Each microlens has a small focal length and processes a portion of the light, collectively achieving the light coupling function that would otherwise require a large single lens, thereby reducing the overall optical system volume while maintaining coupling efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from using a single large lens in the lateral dimension to using multiple small microlenses arranged in a two-dimensional array on the chip surface. This dimensional change allows the light coupling function to be distributed across the chip area, eliminating the need for large external optical elements and reducing system volume

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If large-scale lenses are used to convert wide-angle light beams into highly directional beams, then the light directionality is improved, but the device complexity increases

Engineering Contradiction:
Improvelight directionalityVSAvoidoptical system complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent merges the light-emitting function and the light-shaping function into a single integrated structure. The microlens array is fabricated directly on the light-emitting chip, combining what would traditionally be separate components (light source and optical elements) into one unit, thereby reducing device complexity while achieving highly directional light output

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The light-emitting chip is designed to perform multiple functions simultaneously: generating light and shaping it into a directional beam. The microlens array integrated on the chip provides both focusing and collimation functions, making the chip a multi-functional component that reduces the need for additional separate optical elements

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration enhances optical coupling efficiency, reduces the number of secondary optical elements, and miniaturizes the optical system while maintaining high directional light output.

Implementation Method 1

The microlens layer is disposed on the light-emitting diode chip and the reflective layer along a stacking direction and includes multiple microlenses arranged in an array

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 2

The reflective layer surrounds the light-emitting diode chip

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS20260090153A1Chip package and light-emitting device
Publication Date: 2026.03.26 GUANGZHOU LUXVISIONS INNOVATION TECH LTD
  • US20260090153A1 patent drawing
  • US20260090153A1 patent drawing
  • US20260090153A1 patent drawing

AI summary

A chip package includes a light-emitting diode chip, a reflective layer, and a microlens layer. The reflective layer surrounds the light-emitting diode chip. The microlens layer is disposed on the light-emitting diode chip and the reflective layer along a stacking direction and includes multiple microlenses arranged in an array. A light-emitting device is also provided.