LED Display Chip Mounting Using Diced Boards and Carrier Alignment
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Solution Overview
Problem
Existing LED display manufacturing methods face inefficiencies in aligning and mounting LED chips on circuit boards due to the large size of the multi-sided substrate, leading to reduced manufacturing throughput.
Innovation Solution
A method involving dicing a multi-sided board into smaller circuit boards with alignment marks, arranging them on a carrier board, and using a bonding device with alignment steps to facilitate precise mounting of LED chips, improving throughput by allowing global and local alignment in batches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a large multi-sided substrate is used to produce multiple LED displays, then manufacturing capacity is increased, but alignment precision and mounting accuracy deteriorate due to the large size
Solution Approach 1:
The patent divides the large multi-sided substrate into multiple smaller circuit boards through dicing. Each diced circuit board is then mounted on the carrier board separately. This segmentation allows the bonding device to work on smaller, more manageable units, maintaining high alignment precision while still producing multiple LED displays from the original large substrate, thus resolving the contradiction between manufacturing capacity and alignment precision.
2Manufacturing precision
If each circuit board is processed individually through dicing and mounting, then alignment precision is maintained, but manufacturing throughput decreases
Solution Approach 1:
The patent merges multiple diced circuit boards onto a single carrier board, which is then treated as one unit in the bonding device. The bonding device performs alignment and LED chip mounting operations on all circuit boards simultaneously while they are fixed on the carrier board. This combining approach maintains alignment precision for each individual circuit board while significantly improving manufacturing throughput by processing multiple boards in parallel.
3Manufacturing precision
If the multi-sided board is diced into smaller circuit boards, then alignment precision is improved, but the number of processing steps increases
Solution Approach 1:
The patent performs dicing of the multi-sided substrate into smaller circuit boards as a preliminary action before the mounting process. By pre-dicing the substrate, the subsequent bonding process can work with smaller, pre-prepared circuit boards that are easier to align and mount with high precision. This preliminary dicing step, combined with the carrier board approach, actually simplifies the overall process by enabling batch processing rather than increasing complexity.
Data Source
AI summary
A method for manufacturing an LED display includes a dicing step for dicing a plurality of circuit boards from a multi-sided board having the plurality of circuit boards formed within its surface, a first arrangement step for arranging the plurality of circuit boards on a carrier board, a second arrangement step for arranging the carrier board on a mounting stage, and a mounting step for mounting a plurality of LED chips on the plurality of circuit boards on the mounting stage.