LED Chip Mounting Guide Plate with Tunnels for Flexible Substrates
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Solution Overview
Problem
Inorganic LEDs are challenging to mass-produce due to their inability to be formed directly on flexible substrates, which complicates the manufacturing of full-color display apparatuses and results in reduced LED chip mounting accuracy and increased risk of chip damage during the mounting process.
Innovation Solution
An LED chip mounting apparatus featuring a guide plate with tunnels and a mask system that accurately positions and secures LED chips on an array substrate, utilizing a solution or inert gas to move the chips into place, and incorporating flexible particles to prevent collisions and damage, thereby enhancing mounting precision and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If LED chips are mounted on flexible substrates using conventional methods, then mass production is enabled, but mounting accuracy decreases and chip damage risk increases
Solution Approach 1:
The guide plate is segmented into multiple tunnels, each dedicated to transporting and positioning a specific LED chip. This segmentation allows precise control of each chip's placement while enabling simultaneous processing of multiple chips, thus maintaining high mounting accuracy during mass production
Solution Approach 2:
LED chips are preliminarily positioned and secured in individual tunnels on the guide plate before the actual mounting process. This preliminary positioning ensures that chips are pre-aligned with the correct orientation and location, preventing positioning errors during mass production
2Productivity
If LED chips are mounted on flexible substrates using conventional methods, then mass production is enabled, but the risk of chip damage increases
Solution Approach 1:
Each tunnel in the guide plate is designed to securely hold and cushion the LED chip during transport and positioning. This cushioning structure prevents chips from colliding with each other or the substrate, reducing damage risk while enabling mass production through simultaneous processing
Solution Approach 2:
The guide plate acts as an intermediary device between the LED chip supply and the flexible substrate. It provides a controlled environment for chip handling, protecting chips from direct contact and potential damage during the mass production process
3Manufacturing precision
If a mask system is used to position LED chips, then mounting accuracy improves, but device complexity increases
Solution Approach 1:
The mask system is merged with the guide plate structure, where the mask is integrated into the tunnel walls or base. This combination eliminates the need for separate mask positioning mechanisms, reducing device complexity while maintaining the precision benefits of the mask system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the accuracy and reliability of LED chip mounting, reduces the risk of chip damage, and facilitates the mass production of full-color display apparatuses by accurately seating LED chips on the substrate, ensuring efficient and reliable manufacturing processes.
Implementation Method 1
immersing the guide plate, the array substrate, and the at least one LED chip into a solution after attaching the guide plate and the array substrate together, wherein the at least one LED chip may move in the first tunnel by the solution
Implementation Method 2
The at least one LED chip may move in the first tunnel by air or inert gas
Implementation Method 3
The solution may include a conductive particle, and the at least one LED chip may move in the first tunnel by the solution including the conductive particle
Implementation Method 4
The solution may include at least one flexible particle, and the at least one LED chip and the at least one flexible particle may be alternately inserted into the first tunnel
Data Source
AI summary
A light emitting diode chip mounting apparatus includes a guide plate including a first surface and a second surface opposite to the first surface, the second surface including at least one first tunnel that extends in a first direction, wherein the first tunnel defines a concave portion and the second surface includes a convex portion adjacent to the concave portion. The first tunnel is sized to accommodate a light emitting diode chip flowing therethrough.