LED Chip Array Open-Region Layout for Passive Lamp Cooling
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Solution Overview
Problem
High-power LED lamps face significant challenges with heat dissipation, leading to reduced lighting efficiency and shortened lifespan due to ineffective management of waste heat.
Innovation Solution
The LED lamp design incorporates a heat sink with fins and a base, a lamp shell with a sleeve, and a power source configuration that includes a heat transferring path from LED chips to a passive heat dissipating element, along with specific air flow channels and vents for enhanced heat dissipation, and an open region between LED chips to facilitate air flow and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-power LED chips are used to increase lighting output, then illumination intensity is improved, but heat generation increases leading to reduced lighting efficiency and shortened lifespan
Solution Approach 1:
The patent converts the harmful heat generated by high-power LED chips into a beneficial cooling mechanism by designing heat dissipation channels that guide air flow through the LED chip array. The heat that would otherwise damage the LEDs is now used to drive natural convection current, creating a self-cooling effect that maintains lighting efficiency and extends lifespan.
Solution Approach 2:
The patent introduces air as an intermediary medium to transfer heat away from the LED chips. By creating dedicated heat dissipation channels and open regions, air flows through the LED array, absorbing heat from the chips and transporting it to external environments, thus preventing heat accumulation and maintaining optimal operating temperatures.
2Illumination intensity
If LED chips are placed closely together to increase light output density, then illumination intensity is improved, but heat dissipation efficiency deteriorates due to blocked air flow
Solution Approach 1:
The patent segments the LED chip array into multiple independent heat dissipation zones, each with its own heat dissipation channel. By dividing the dense LED array into smaller units with interspersed open regions, air flow can penetrate through each segment separately, preventing heat accumulation even when LEDs are closely packed for high light output density.
Solution Approach 2:
The patent applies different structural qualities to different regions of the LED array. Open regions are strategically positioned between adjacent LED chips to create localized air flow paths, while LED chips are densely arranged in illumination zones. This local differentiation allows high light output density in certain areas while maintaining effective heat dissipation in others.
3Reliability
If a closed lamp shell structure is used to protect internal components, then reliability is improved, but heat dissipation deteriorates due to restricted air flow
Solution Approach 1:
The patent employs a nested structure where the lamp shell encloses the LED array and power source for protection, while within this enclosed space, heat dissipation channels and open regions are integrated. The lamp shell contains the cooling air flow paths and heat dissipation elements, creating a nested arrangement that maintains component protection while enabling effective heat removal through the contained convection current.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated by high-power LED lamps, improving lighting efficiency and extending their lifespan by ensuring efficient heat transfer and air flow, thereby maintaining performance and longevity.
Implementation Method 1
a heat transferring path from the LED chips to the passive heat dissipating element
Implementation Method 2
a second heat dissipating channel formed in the heat sink and between the fins and the base of the heat sink for dissipating the heat generated from the LED chips and transferred to the heat sink
Implementation Method 3
an open region is formed between adjacent two LED chips of the same LED chip set on the light emitting surface... to allow air flowing from outside of the LED lamp into the first chamber
Data Source
AI summary
An LED lamp includes: a lamp shell; a passive heat dissipating element having a heat sink, wherein the heat sink comprises fins and a base; a power source; a light emitting surface connected to the heat sink of the passive heat dissipating element and comprising LED chips; a first heat dissipating channel formed in a first chamber of the lamp shell; a second heat dissipating channel formed in the heat sink and between the fins and the base of the heat sink; and a lamp cover connected with the heat sink and having a light output surface and an end surface; wherein the light emitting surface include at least two LED chip sets having the LED chips, an open region is formed between adjacent two LED chips of the same LED chip set on the light emitting surface, the open region between any two adjacent LED chips of one of the two adjacent chip sets on the light emitting surface interlaces to and communicates with the open region between any two adjacent LED chips of another one of the chip sets on the light emitting surface in a radial direction of the light emitting surface.