LED Chip-Level Package with Embedded Substrate and Photonic Structures
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Solution Overview
Problem
Current light-emitting device packages are large, inefficient, and costly, requiring complex manufacturing processes and sub-mounts for heat dissipation and electrical connections, which hinder the development of compact, high-efficiency LED solutions.
Innovation Solution
A chip-level package with a permanent substrate embedded with thermally-conductive and insulating materials, featuring light extraction microstructures and photonic crystal structures formed using nanoimprint technology, which enhances light extraction efficiency and eliminates the need for sub-mounts by integrating electrical connections directly with the semiconductor epitaxial stack layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a sub-mount is used for heat dissipation and electrical connections, then the light-emitting device can be assembled with separate components, but the overall device size increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the sub-mount, heat dissipation structure, and electrical connection elements into a single integrated permanent substrate. The permanent substrate contains embedded passive devices and provides both mechanical support and electrical connectivity, eliminating the need for separate sub-mount components and reducing overall device size.
Solution Approach 2:
The permanent substrate serves multiple functions simultaneously: it provides mechanical support, heat dissipation through thermally-conductive materials, electrical connections through embedded passive devices, and structural stability. This multi-functional design replaces the traditional multi-component assembly.
2Ease of manufacture
If traditional packaging is used, then electrical connections can be established, but light extraction efficiency is reduced due to random light emission
Solution Approach 1:
The patent introduces light extraction microstructures at specific locations on the semiconductor epitaxial stack layer to control light emission directionality. These localized structural modifications create regions with different optical properties that redirect light upward while maintaining electrical connection functionality.
Solution Approach 2:
The patent adds vertical dimensionality to light extraction by creating microstructures that redirect light from random isotropic emission to preferential upward directional emission. This dimensional control of light propagation enhances extraction efficiency without compromising electrical connections.
3Volume of moving object
If the package is made compact at chip level, then device size is reduced, but heat dissipation becomes more challenging
Solution Approach 1:
The permanent substrate is constructed from composite materials including thermally-conductive materials and insulating materials. This composite structure provides efficient heat dissipation pathways while maintaining electrical insulation and mechanical support, enabling compact packaging without compromising thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the size of light-emitting devices, simplifies manufacturing, and significantly enhances light extraction efficiency by directing emitted light upwards, reducing scatter angles and improving overall performance.
Implementation Method 1
a photonic crystal structure formed by the nanoimprint technology. The photonic crystal structure assures the light emitted from the light-emitting diode not to emit randomly and to increase the chance for the light to emit upwards
Implementation Method 2
The material of the high thermally-conductive material can be silver, cupper, graphite, silicon carbide, or gold. The high thermally-conductive material region includes a plurality of thermal conduction through-holes to dissipate the heat effectively
Data Source
AI summary
The application discloses a light-emitting diode chip level package structure including: a permanent substrate having a first surface and a second surface; a first electrode on the first surface; a second electrode on the second surface; an adhesive layer on where the first surface of the permanent substrate is not covered by the first electrode; a growth substrate on the adhesive layer; a patterned semiconductor structure on the growth substrate; a third electrode and a fourth electrode on the patterned semiconductor structure and electrically connect with the patterned semiconductor structure; an electrical connecting structure on the sidewall of the patterned semiconductor structure electrically connecting the third electrode and the fourth electrode with the first electrode; and an insulation layer located on the side wall of the patterned semiconductor structure and between the electrical connecting structure for electrically insulating the patterned semiconductor structure.