LED Chip Arrays with Non-Uniform Phosphor Distribution
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Solution Overview
Problem
Conventional LED devices face challenges in achieving high luminous flux densities at high power applications due to excessive localized heating, leading to thermal degradation, cracking, and reliability issues.
Innovation Solution
The development of light emitter devices with a high-density array of LED chips and a non-uniform distribution of wavelength conversion materials, such as phosphors, over a substrate, which enhances thermal management and reliability by settling the phosphors in predetermined portions to prevent encapsulant cracking and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a high-density array of LED chips is used to achieve high luminous flux density, then light output performance is improved, but excessive localized heating occurs leading to thermal degradation and reliability issues
Solution Approach 1:
The patent applies local quality by creating a non-uniform distribution of wavelength conversion materials (phosphors) with varying concentrations in different regions. This non-uniform phosphor distribution allows different local areas to have optimized thermal and optical properties, enabling high luminous flux density while managing localized heating through region-specific phosphor concentrations that convert light and dissipate heat more effectively in high-density LED arrays
2Productivity
If high power is applied to achieve high lumen density, then light output is improved, but thermal degradation and cracking of encapsulant occur
Solution Approach 1:
The patent applies parameter changes by modifying the concentration and distribution parameters of wavelength conversion materials. By varying phosphor concentration across different regions rather than using a uniform distribution, the device can operate at high power levels with improved thermal management. This parameter optimization allows high lumen density while preventing thermal degradation and encapsulant cracking that would otherwise occur at high power
3Ease of manufacture
If wavelength conversion materials are uniformly distributed, then manufacturing is simplified, but thermal management and prevention of encapsulant cracking are compromised
Solution Approach 1:
The patent resolves this contradiction by implementing local quality through non-uniform phosphor distribution. While this increases manufacturing complexity compared to uniform distribution, it provides superior thermal management and prevents encapsulant cracking. The localized variation in phosphor concentration allows different regions to be optimized for both manufacturing considerations and thermal performance, achieving a balance between ease of manufacture and heat dissipation capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved lumen density, reliability, and thermal management, reducing defects and maintaining brightness over extended periods, while also providing sulfur resistance and uniform color rendering.
Implementation Method 1
A representative example of an LED device comprises a device having at least one LED chip, a portion of which can be coated with a lens or layer of material having uniformly dispersed phosphoric material provided therein such as, for example, yttrium aluminum garnet (YAG). The uniform coating can convert light emitted from one or more LED chips into white light. For example, LED chips can emit light having desired wavelengths, and phosphor can in turn emit yellow fluorescence with a peak wavelength of about 550 nm
Data Source
AI summary
Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.


