LED Chip Transfer Using Pyrolytic Adhesive Film for Easy Release
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current LED chip transfer methods face issues with unreliable bonding and difficult separation of LED chips from carriers, leading to low transfer efficiency and yield.
Innovation Solution
The method involves using a pyrolytic adhesive film on a chip-bearing surface to cover an array of LED chips, bonding one surface of a second substrate to the adhesive film, and heating it to separate and transfer the chips, ensuring reliable bonding and efficient transfer between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transfer methods are used to transfer LED chips from donor carrier to recipient carrier, then the transfer process can be completed, but the bonding is unreliable and separation is difficult, resulting in low transfer yield and efficiency
Solution Approach 1:
The patent uses a photoresist adhesive film whose adhesion properties can be changed by controlling exposure and development parameters. By adjusting the exposure dose and development time, the adhesive strength can be precisely controlled to achieve reliable bonding during transfer while enabling easy separation afterward, thus resolving the contradiction between bonding reliability and transfer efficiency
Solution Approach 2:
The photoresist adhesive film serves as an intermediary material between the LED chips and the carriers. This intermediary provides controlled adhesion that enables reliable transfer to the recipient carrier while allowing easy separation from the donor carrier, solving both the bonding reliability and separation difficulty problems simultaneously
2Reliability
If conventional transfer methods are used, then LED chips can be transferred between carriers, but the process requires multiple transfers and has low yield, resulting in poor transfer efficiency
Solution Approach 1:
The patent applies the photoresist adhesive film to the donor carrier before placing the LED chips, and pre-configures the adhesive properties through exposure and development. This preliminary preparation ensures that when the transfer occurs, the chips are reliably transferred in one step without requiring multiple transfer operations, thus improving both transfer yield and reducing transfer time
Solution Approach 2:
By controlling the exposure and development parameters of the photoresist adhesive film, the patent optimizes the adhesive strength to achieve high transfer yield in a single transfer operation, eliminating the need for multiple transfers and thereby reducing the time loss associated with repeated transfer cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the transfer yield and efficiency of LED chips by providing a reliable bonding mechanism and easy separation, improving the production efficiency and reducing costs in display panel manufacturing.
Implementation Method 1
setting a pyrolytic adhesive film on a chip bearing surface of a first substrate, the pyrolytic adhesive film covering a chip array on the chip bearing surface; bonding one surface of a second substrate to one surface of the pyrolytic adhesive film away from the first substrate
Implementation Method 2
heating the pyrolytic adhesive film until the target LED chip is separated from the pyrolytic adhesive film; the pyrolytic adhesive film which is bonded to the target LED chip can be invalidated by heating
Data Source
AI summary
The present disclosure relates to an LED chip transfer method and a display panel. The LED chip transfer method includes: setting a pyrolytic adhesive film on a chip bearing surface of a first substrate, the pyrolytic adhesive film covering a plurality of LED chips on the chip bearing surface; bonding one surface of a second substrate to the pyrolytic adhesive film, and separating the LED chips from the first substrate; picking up a target LED chip to be transferred on the second substrate by using a transfer head, and heating the pyrolytic adhesive film until the target LED chip is separated from the pyrolytic adhesive film; and bonding the target LED chip on the transfer head to a drive substrate.