LED Chip Reflective Layer for Uniform Light Distribution
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Solution Overview
Problem
Semiconductor LEDs have limitations as point sources, requiring additional optical structures for even light distribution, which increases manufacturing costs and can thicken display panels.
Innovation Solution
A semiconductor light emitting device with a reflective layer, such as a distributed Bragg reflector (DBR) or metal reflective layer, is integrated onto the LED chip to control light distribution, allowing for uniform light emission without the need for external optical structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If additional optical structures (lens, diffusion sheet) are used to spread light evenly, then light distribution uniformity is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent integrates the light distribution function directly into the LED chip structure by forming a convex lens on the light-emitting surface and configuring electrode patterns, merging what were previously separate optical components into the chip itself. This eliminates the need for external lenses and diffusion sheets, reducing device complexity while maintaining light distribution uniformity
Solution Approach 2:
The LED chip is designed to perform multiple functions simultaneously: light generation, light distribution control, and electrical connection. The convex lens structure and electrode pattern configuration enable the chip to control light distribution patterns (spot, flood, or a combination) without requiring additional dedicated optical components, achieving multi-functionality
2Illumination intensity
If additional optical structures are added to control light distribution, then light distribution control is improved, but manufacturing cost increases
Solution Approach 1:
By integrating light distribution control features directly into the LED chip manufacturing process through convex lens formation and electrode pattern configuration, the patent eliminates the need for separate optical components and their associated assembly steps, thereby reducing manufacturing cost while maintaining light distribution control capability
Solution Approach 2:
The patent controls light distribution by adjusting parameters within the LED chip structure itself, such as convex lens curvature, electrode pattern geometry, and material properties, rather than requiring additional components. This parameter-based control approach simplifies manufacturing and reduces costs
3Illumination intensity
If additional optical structures are used for light distribution, then light distribution uniformity is improved, but panel thickness increases
Solution Approach 1:
The patent integrates light distribution control functions directly into the LED chip structure, eliminating the need for separate optical components such as external lenses and diffusion sheets that would increase panel thickness. The convex lens and electrode patterns within the chip provide the necessary light distribution control without adding to overall panel thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform light distribution and reduces the need for additional optical components, lowering manufacturing costs and panel thickness while maintaining efficient light emission.
Implementation Method 1
a reflective layer disposed on at least one of the second surface and the side surfaces of the semiconductor LED chip
Implementation Method 2
The reflective layer may include a distributed Bragg reflector (DBR) layer. Transmissivity of light emitted from the semiconductor LED chip and passing through the DBR layer may be greater at a second incident angle than at a first incident angle
Data Source
AI summary
A semiconductor light emitting device includes a wiring board including a mounting surface on which a first wiring electrode and a second wiring electrode are disposed; a semiconductor light emitting diode (LED) chip including a first surface on which a first electrode and a second electrode are disposed, the first surface facing the mounting surface, the semiconductor LED chip further including a second surface positioned opposite to the first surface, and side surfaces positioned between the first and second surfaces, the first and second electrodes being connected to the first and second wiring electrodes, respectively; and a reflective layer disposed on at least one of the second surface and the side surfaces of the semiconductor LED chip.