LED Chip Structure with Removable Magnetic Layer for Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED chip transferring methods are inefficient and lack effective separation of magnetic material layers from LED chips during the transfer process.
Innovation Solution
An LED chip structure with a removable connection layer and a magnetic material layer, where the magnetic material layer is separated from the LED chip by removing the connection layer, and a chip transferring system utilizing an electromagnetic field generating module and a connection layer removing module to transfer LED chips onto a circuit substrate while separating the magnetic material layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional LED chip transferring method is used, then the transfer process is simple, but the transferring efficiency is low and magnetic material layer separation is ineffective
Solution Approach 1:
The chip structure is segmented into distinct functional layers: LED chip, removable connection layer, and magnetic material layer. This segmentation allows independent optimization of each layer's function, enabling efficient transfer through magnetic interaction while maintaining the ability to separate the magnetic material layer after bonding, thus resolving the contradiction between transferring efficiency and structure complexity.
Solution Approach 2:
The removable connection layer serves as an intermediary between the LED chip and magnetic material layer. This intermediate layer enables magnetic field-based manipulation and transfer of the chip structure while allowing subsequent removal to separate the magnetic material layer, achieving high transferring efficiency without permanent complexity.
2Stability of the object's composition
If magnetic material layer is permanently attached to LED chip, then structural stability is high, but separation capability is lost
Solution Approach 1:
The removable connection layer is designed in advance to provide temporary but stable bonding during the transfer process. This preliminary stable connection enables reliable magnetic field-based manipulation and transport, while the inherent removability of the connection layer preserves the capability to separate the magnetic material layer after bonding is complete.
Solution Approach 2:
The connection between the magnetic material layer and LED chip transitions from a static permanent bond to a dynamic temporary bond. The removable connection layer provides stable attachment during transfer operations, then allows controlled separation when the bonding process is complete, achieving both structural stability and separation capability through dynamic design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient transfer of LED chips onto a circuit substrate with the magnetic material layer separation, improving the existing methods by ensuring precise and effective detachment of the magnetic material layer from the LED chip.
Implementation Method 1
The electromagnetic field generating module includes a movable carrier board and a plurality of electromagnetic heads disposed on the movable carrier board, and the LED chip structure is transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module
Implementation Method 2
Each of the LED chip structures includes an LED chip, a removable connection layer and a magnetic material layer
Data Source
AI summary
An LED chip structure, a chip transferring system and a chip transferring method are provided. The chip transferring system includes a liquid receiving tank, an electromagnetic field generating module and a connection layer removing module. A plurality of LED chip structures are randomly distributed in the liquid substance of the liquid receiving tank. The electromagnetic field generating module movably is disposed inside or removed from the liquid receiving tank. The connection layer removing module is disposed above the circuit substrate. Each of the LED chip structures includes an LED chip, a removable connection layer and a magnetic material layer. The LED chip structure can be transferred from the liquid receiving tank onto a circuit substrate by the electromagnetic field generating module, and the magnetic material layer can be separated from the LED chip while the removable connection layer is removed by the connection layer removing module.