LED Module Chip Repair via Laser Bonding Softening
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Solution Overview
Problem
Semiconductor chips, particularly in LED modules, often experience faulty light-emitting units that cannot be efficiently identified and replaced, leading to reduced performance and reliability in applications like full-color LED displays.
Innovation Solution
A method and device that utilize an LED module with a circuit substrate, a signal generator, a feature detector module, a laser generating module, and a chip pick-and-place module to identify abnormal light-emitting units, decrease their bonding strength with the substrate using a laser, remove them, and replace them with functional units, ensuring continuous operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If faulty light-emitting units are not identified and replaced, then the LED module continues operating with defective components, but the brightness uniformity and display quality deteriorate
Solution Approach 1:
The patent implements preliminary identification and replacement of faulty light-emitting units before they cause significant display quality degradation. The control circuit detects abnormal light-emitting units and triggers replacement procedures proactively, maintaining brightness uniformity and display quality before problems escalate.
2Productivity
If a manual replacement process is used, then the replacement process becomes simple and low-cost, but the identification and replacement efficiency are reduced
Solution Approach 1:
The control circuit serves multiple functions: it controls the operation of light-emitting units, detects abnormal units through their operational status, and triggers the replacement process. This multi-functionality integrates detection and control capabilities into existing circuitry, improving replacement efficiency without significantly increasing system complexity.
3Strength
If the bonding strength of light-emitting units to the substrate is increased, then the mechanical stability is improved, but the ease of removing faulty units for replacement is reduced
Solution Approach 1:
The patent utilizes laser irradiation to locally change the thermal parameters of the bonding material between the light-emitting unit and substrate. The laser heating softens or degrades the bonding material at the specific faulty unit location, reducing bonding strength locally and enabling easy removal of the defective unit while maintaining strong bonding for functional units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the precise identification and replacement of faulty light-emitting units, maintaining high brightness and contrast in LED displays by ensuring only functional units are connected to the circuit substrate, thereby extending the lifespan and performance of the LED modules.
Implementation Method 1
projecting a laser light source generated by a laser generating module onto the bad light-emitting unit so as to decrease the bonding strength between the bad light-emitting unit and the circuit substrate
Implementation Method 2
projecting the laser light source generated by the laser generating module onto the good light-emitting unit so as to fix the good light-emitting unit on the circuit substrate
Data Source
AI summary
The present invention provides a method and a device for repairing semiconductor chips. The method includes providing an LED module including a circuit substrate and a plurality of light-emitting units; driving the light-emitting units by a signal generator; measuring at least one light-emitting unit by a feature detector module so as to obtain an abnormal feature and define the at least one light-emitting unit as a bad light-emitting unit having the abnormal feature; projecting a laser light source generated by a laser generating module onto the bad light-emitting unit; removing the bad light-emitting unit from the circuit substrate by a chip pick-and-place module to form a vacancy; placing a good light-emitting unit inside the vacancy by the chip pick-and-place module; and electrically connecting the good light-emitting unit to the circuit substrate. Therefore, the bad light-emitting unit is replaced by the good light-emitting unit for repairing the LED module.