LED Chip Replacement Contacts With Integrated Power Cutoff

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Solution Overview

Problem

Conventional methods for replacing defective chips in electronic components, such as LED packages or displays, are cumbersome and costly, often requiring complex external circuits to deactivate and replace the defective chips.

Innovation Solution

A device and method utilizing standard and repair contacts, along with an electronic switch, allow for the direct electrical connection and replacement of defective chips with identical repair chips, disconnecting the defective ones from the power supply using an electronic switch.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional external circuits are used to deactivate and replace defective chips, then the defective chip can be deactivated, but the device complexity and manufacturing cost increase

Engineering Contradiction:
Improvedefective chip deactivationVSAvoidexternal circuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the deactivation function from external circuits and relocates it directly onto the chip substrate. The electronic switch is integrated into the substrate, eliminating the need for complex external deactivation circuits while maintaining the ability to deactivate defective chips reliably

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an electronic switch as an intermediary element between the power supply and the chip. This switch acts as a controlled mediator that can selectively connect or disconnect power to individual chips, enabling precise deactivation without requiring complex external circuitry

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of repair

If conventional external circuits are used to replace defective chips, then chip replacement is possible, but the manufacturing cost increases

Engineering Contradiction:
Improvechip replacement capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Ease of repairVSEase of manufacture

Solution Approach 1:

The patent prepares the substrate in advance with integrated electronic switches and multiple contact points during the initial manufacturing process. This preliminary preparation enables easy chip replacement later without requiring additional complex manufacturing steps or expensive external circuits

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The substrate is designed with universal contact points and integrated switches that can accommodate both original chips and replacement chips. This multi-functional design allows the same substrate structure to handle chip installation, deactivation, and replacement operations, reducing manufacturing complexity and cost

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If laser cutting is used to deactivate defective chips, then the defective chip is switched powerless, but the process precision and potential damage to surrounding areas increase

Engineering Contradiction:
Improvechip deactivationVSAvoidcurrent feedthrough cutting precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical/thermal laser cutting process with an electronic control mechanism. Instead of physically cutting conductor tracks with laser, the system uses an electronic switch to electrically disconnect power to the defective chip, achieving the same deactivation goal without the precision risks of laser cutting

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies and reduces the cost of replacing defective chips by enabling direct electrical connection and disconnection, making the process more efficient and cost-effective compared to conventional methods.

Implementation Method 1

an electronic switch that electrically connects the first standard electrical contact to a power supply source

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the repair chip is power supplied by means of the first and third repair contacts and electrically connects the first and second repair contacts to one another

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12538609B2Device and method for replacing at least one chip
Publication Date: 2026.01.27 OSRAM OPTO SEMICON GMBH & CO OHG
  • US12538609B2 patent drawing
  • US12538609B2 patent drawing
  • US12538609B2 patent drawing

AI summary

A device for replacing at least one chip or electronic element of an electronic component, in particular an LED package or an LED display, includes at least two standard electrical contacts to which a chip comprising at least two electrical contacts is electrically connectable. The device also includes an electronic switch electrically connecting the first standard electrical contact to an electrical power supply source, and least three electrical repair contacts to which a repair chip identical in construction to the chip is electrically connectable. The first electrical repair contact is electrically connected to the electrical power supply source. The second electrical repair contact is electrically connected to the electronic switch. The third electrical repair contact is electrically connected to the second electrical standard contact.