LED Chip Segmentation and Vertical Stacking for Thermal Management
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Solution Overview
Problem
Multi-chip light-emitting devices face challenges in fabrication complexity, heat dissipation, and light field interference due to the narrow space between LED chips, which affects light wavelength and fabrication costs.
Innovation Solution
A light-emitting device with a supporting structure featuring through holes and adhesive layers that separate and control the light-emitting elements, allowing for independent control of each element's lighting state and minimizing light interference through conductive structures and wavelength conversion materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple LED chips are arranged in narrow space to create multi-chip light-emitting device, then light output and functionality are improved, but light field interference between chips increases and fabrication complexity increases
Solution Approach 1:
The patent divides the light-emitting device into multiple independent chip units, each with its own light-emitting element and electrode structure. This segmentation allows each chip to be manufactured and tested separately before final assembly, reducing overall fabrication complexity while maintaining high light output through multiple independent sources.
Solution Approach 2:
The patent transitions from planar arrangement of chips to a three-dimensional stacked configuration where chips are arranged vertically along the light-emitting direction. This dimensional change enables better heat dissipation, reduces light field interference between neighboring chips, and simplifies the overall device structure while maintaining high light output.
2Power
If multiple LED chips are arranged in narrow space, then light output is improved, but light wavelength control and light field design are affected
Solution Approach 1:
The patent applies different phosphor materials with specific characteristics to different chip locations or layers. This local quality approach allows precise control of light wavelength and color temperature for each chip, ensuring that the overall device achieves desired spectral properties while maintaining high light output from multiple chips.
3Volume of moving object
If multiple LED chips are arranged in narrow space, then device compactness is improved, but heat dissipation becomes difficult
Solution Approach 1:
The patent arranges chips in a vertical stacked configuration rather than horizontal arrangement, creating extended heat dissipation pathways in the vertical direction. This three-dimensional arrangement maintains device compactness in the horizontal plane while providing adequate space for heat dissipation structures such as heat sinks or thermal management layers between chips.
4Volume of moving object
If phosphor is mounted close to chip to save space, then device size is reduced, but light wavelength bias occurs due to repeated light passage
Solution Approach 1:
The patent positions phosphor layers in three-dimensional space around and between chips rather than only in the horizontal plane. This vertical arrangement increases the optical path length and reduces the probability of light repeatedly passing through the same phosphor region, thereby minimizing wavelength bias while maintaining compact device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light field distribution, reduces fabrication complexity, and allows for the production of white light with improved color gamut and luminous efficiency by separating and controlling the light-emitting elements effectively.
Implementation Method 1
wavelength conversion materials
Data Source
AI summary
The present application discloses a light-emitting device including a first support structure having a first surface, a plurality of light-emitting elements arranged on the first surface, and a first adhesive layer arranged on the first support structure. Each light-emitting element has a side wall, a bottom surface, a first electrode pad, and a second electrode pad arranged on the bottom surface. The first adhesive layer surrounds the side wall and does not directly contact the bottom surface. The first support structure includes a plurality of through holes located on positions corresponding to the first electrode pad and the second electrode pad.