LED Chip Separation Using UV-Responsive Buffer Layer

The patent introduces a buffer layer as an intermediary between the substrate and the adhesive layer. This buffer layer absorbs the ultraviolet light energy and breaks down into particles, preventing the UV light from directly damaging the adhesive layer while still enabling effective chip separation. The buffer layer acts as a mediator that converts the harmful UV exposure into a controlled decomposition process.

The buffer layer is applied in advance to the substrate before bonding the LED chips with the adhesive layer. This preliminary action ensures that when ultraviolet light is subsequently applied for chip separation, the adhesive layer is already protected by the buffer layer, preventing any UV-induced damage before it can occur.

The buffer layer serves as a protective intermediary that absorbs ultraviolet light energy, preventing this energy from reaching the adhesive layer. By blocking the UV light, the buffer layer prevents the adhesive layer from undergoing burning or carbonization reactions, while still allowing complete chip separation to occur.

The patent converts the potentially harmful ultraviolet light into a beneficial effect by using it to decompose the buffer layer into particles. This decomposition of the buffer layer actually protects the adhesive layer from UV damage, transforming what would be a harmful exposure into a protective mechanism.