LED Chip Silicon Walls for Thermal and Optical Control
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Solution Overview
Problem
Conventional LED chips face challenges in achieving a narrow beam of light with high precision and efficient heat dissipation due to high thermal resistance and the need for expensive secondary optics, which are inefficient and costly.
Innovation Solution
The method involves forming silicon walls on the LED chip to control light emission, integrate phosphor and lens materials, and enhance heat dissipation, allowing for the production of LED chips with reduced thermal resistance and simplified optics design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional LED chips are used with a thick carrier substrate for heat dissipation, then the LED structure is mechanically stable, but the thermal resistance is high and heat dissipation is inefficient
Solution Approach 1:
The patent extracts and removes the thick carrier substrate (70-350 μm) that causes high thermal resistance, replacing it with a thin adhesive layer (1-10 μm) that bonds the LED chip directly to the heat dissipation structure, thereby reducing thermal resistance while maintaining mechanical stability
Solution Approach 2:
The patent changes the thickness parameter of the substrate/adhesive layer from 70-350 μm to 1-10 μm, fundamentally altering the thermal resistance characteristics and enabling efficient heat dissipation while maintaining structural integrity
2Illumination intensity
If expensive low profile secondary optics are used to achieve a narrow beam of light, then the beam angle is reduced, but the manufacturing cost increases significantly
Solution Approach 1:
The patent merges the optical beam control function directly into the LED chip structure by forming refractive index patterns in the semiconductor layers, eliminating the need for separate secondary optics components and thereby reducing manufacturing cost while achieving narrow beam control
Solution Approach 2:
The LED chip structure is designed to perform multiple functions: light emission, heat dissipation, and optical beam shaping, by integrating refractive index patterns directly into the chip layers, making the chip itself a multi-functional component that eliminates the need for additional optical elements
3Manufacturing precision
If phosphor material is applied over the LED chip in a carrier with a dam structure for controlled dispensing, then the phosphor distribution is even and controlled, but the assembly cost increases
Solution Approach 1:
The patent merges the phosphor containment and distribution control function into the LED chip structure itself by forming recesses and using the thin substrate structure, eliminating the need for separate carrier and dam components, thereby reducing assembly cost while maintaining precise phosphor distribution control
4Measurement precision
If secondary optics are placed around the package to collimate light, then the light beam is directed precisely, but the device complexity and cost increase
Solution Approach 1:
The patent merges the light collimation and direction control function directly into the LED chip by forming specific refractive index patterns in the semiconductor layers, eliminating the need for external secondary optics and thereby reducing device complexity while achieving precise beam direction control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of LED chips that can produce a narrow beam of light with high precision and reduced thermal resistance, eliminating the need for expensive secondary optics and lowering manufacturing costs while achieving efficient light collimation and heat management.
Implementation Method 1
one or more silicon walls are provided on the first surface for directing the light emitted
Implementation Method 2
the step of selectively etching the first substrate from the LED structure provides the first surface of the LED structure with a surface texture
Implementation Method 3
A second substrate (140), made from a silicon wafer, is bonded to the fabricated GaN structure using a permanent, conductive adhesive (145)
Data Source
AI summary
A method for the manufacture of a light-emitting diode (LED) chip, the method comprising providing a first substrate; forming an LED structure on the first substrate, wherein the LED structure has a first surface adjacent the first substrate and a second surface opposite the first substrate; applying a second substrate on the second surface of the LED structure; and selectively etching the first substrate from the LED structure to form one or more walls extending from the first surface of the LED structure.