LED Chip Substrate Removal and Carrier Transfer
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Solution Overview
Problem
The existing production methods for light-emitting diode chips are not cost-effective, particularly due to the high cost of substrate materials and inefficient radiation management.
Innovation Solution
A light-emitting diode chip design that uses a III/V compound semiconductor material with a carrier separate from the growth substrate, featuring a radiation-transmissive or reflective connecting means for mechanical stabilization and efficient radiation exit, and contact points for electrical connection, allowing for cost-effective production and enhanced radiation management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a growth substrate is used to support the semiconductor body, then mechanical stability is provided during production, but the substrate material cost increases significantly
Solution Approach 1:
The patent separates the growth substrate function from the final device structure. The semiconductor body is grown on a substrate temporarily, then the substrate is removed and replaced with a different carrier structure, dividing the production process into distinct stages with different functional requirements
Solution Approach 2:
The growth substrate is extracted and removed from the final device structure. Only the semiconductor body is retained and transferred to a new carrier, eliminating the need to incorporate expensive substrate materials into the final product
2Strength
If the carrier is made opaque for mechanical stability, then structural support is improved, but radiation transmission efficiency decreases
Solution Approach 1:
The carrier structure is designed with spatially varying properties: certain regions are made radiation-transparent to allow light passage, while other regions provide mechanical support. This local differentiation allows simultaneous optimization of both radiation transmission and structural stability
Solution Approach 2:
A connecting means is introduced as an intermediary element between the semiconductor body and the carrier. This connecting means provides mechanical attachment while being transparent to radiation, mediating between the conflicting requirements of structural support and light transmission
3Ease of manufacture
If contact points are arranged on the side facing the carrier, then electrical connection is simplified, but radiation management efficiency decreases
Solution Approach 1:
The contact points are arranged in a different spatial configuration than conventional designs. Instead of being on the carrier-facing side, they are positioned on the opposite side of the semiconductor body, utilizing the third dimension to resolve the conflict between electrical connection accessibility and radiation management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables cost-effective production of light-emitting diode chips with improved mechanical stability and radiation efficiency, allowing for operation with higher voltages and efficient heat dissipation, while maintaining electrical insulation and radiation transparency.
Implementation Method 1
a radiation-transmissive or reflective connecting means for mechanical stabilization and efficient radiation exit
Implementation Method 2
the semiconductor body has a roughening on its outer surface facing the carrier
Implementation Method 3
a radiation-generating active area, which is arranged between the n-conducting area and the p-conducting area
Data Source
Figure 1A
Figure 1B~1C
Figure 2~3
AI summary
A light-emitting diode chip is specified, comprising - a semiconductor body (1) comprising a radiation-generating active region (13), - at least two contact locations (2a, 2b) for making electrical contact with the active region, - a carrier (3) and - a connecting means (4), arranged between the carrier (3) and the semiconductor body (1), wherein - the semiconductor body (1) has a roughening (15) at its outer surfaces facing the carrier (3), - the semiconductor body (1) is mechanically connected to the carrier (3) by means of the connecting means (4), - the connecting means (4) is in direct contact with the semiconductor body (1) and the carrier (3) in some locations, and - the at least two contact locations (2a, 2b) are arranged at the top side of the semiconductor body (1) that faces away from the carrier (3).