LED Chip Thermal Interface for Heat Dissipation Efficiency
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Solution Overview
Problem
Conventional light emitting diode (LED) devices face reduced heat dissipating efficiency due to the dual function of conductors, which compromises their ability to effectively transmit electric power and dissipate heat simultaneously.
Innovation Solution
A light emitting device design featuring a heat sinking substrate with an electrically insulating layer, a circuit pattern layer, and an electrically insulating and thermally conductive interlayer, where the LED chip is indirectly mounted to the substrate through the interlayer, separating heat dissipation and electric power transmission paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesive layer is disposed between the conductor and the heat sinking base to secure the conductor, then the conductor is securely fixed on the heat sinking base, but the heat dissipating efficiency of the conductor is decreased
Solution Approach 1:
The invention divides the original dual-function conductor into separate functional components: a dedicated heat dissipation path (through the heat sinking base and adhesive layer) and an electrical conduction path (through the circuit board and conductor). This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The adhesive layer serves as an intermediary component that facilitates thermal transfer between the conductor and heat sinking base while being electrically insulating. This intermediary enables heat dissipation without requiring the conductor to directly contact the heat sinking base, thus maintaining both secure fixation and heat dissipating efficiency.
2Device complexity
If the conductor performs both heat dissipation and electric power transmission simultaneously, then the device structure is simplified, but the heat dissipating efficiency cannot be fully exploited
Solution Approach 1:
The invention segments the thermal and electrical functions into separate pathways: heat flows from the LED chip through the adhesive layer to the heat sinking base, while electrical current flows from the LED chip through the conductor to the circuit board. This functional segmentation resolves the contradiction between structural simplicity and heat dissipation efficiency.
Solution Approach 2:
The adhesive layer is designed to serve multiple functions simultaneously: it provides mechanical bonding between the conductor and heat sinking base, acts as a thermal conduction path, and serves as an electrical insulator. This multi-functionality maintains structural simplicity while enabling efficient heat dissipation.
3Device complexity
If the conductor is used for both electric power transmission and heat dissipation, then fewer components are required, but the reliability of heat dissipation is compromised
Solution Approach 1:
The invention creates independent thermal and electrical pathways, where the heat dissipation path (LED chip → adhesive layer → heat sinking base) is separated from the electrical conduction path (LED chip → conductor → circuit board). This segmentation improves reliability by ensuring that electrical conductor performance does not compromise thermal management.
Solution Approach 2:
The adhesive layer acts as a specialized intermediary that is optimized purely for thermal conduction and mechanical bonding, without the compromises inherent in using an electrical conductor for heat dissipation. This intermediary enhances heat dissipation reliability while maintaining electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency while maintaining electric power transmission, improving the stability, luminous efficiency, and lifetime of the LED device by isolating heat dissipation and power transmission paths.
Implementation Method 1
an electrically insulating and thermally conductive interlayer interposed between the bottom portion of the LED chip and the portion of the heat sinking substrate exposed from the electrically insulating layer
Data Source
AI summary
A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.