Spaced LED Chips on Reflective Metal Substrate
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Solution Overview
Problem
Existing LED devices face challenges in maximizing light output and efficient heat dissipation due to closely spaced LED chips interfering with each other, leading to reduced performance and complex, costly manufacturing processes.
Innovation Solution
A light emitting diode apparatus featuring a flat metal substrate with a reflective surface, where LED chips are mounted directly onto the substrate in spaced positions to allow for thermal dissipation and light reflection, with a dielectric insulating layer and bonding wires connecting the chips for electrical connections, eliminating the need for insulating dielectrics and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED chips are mounted closely spaced on a ceramic substrate, then the device can be manufactured with standard processes, but light output is reduced due to interference between chips and heat dissipation is inefficient
Solution Approach 1:
The invention segments the substrate into distinct functional regions: LED chip mounting areas with thermal vias for heat dissipation, and light reflecting areas without vias to prevent light interference and enhance light output. This segmentation allows each region to optimize its specific function while working together as a unified structure.
Solution Approach 2:
The substrate is designed with local quality variations where different regions have different properties: areas under LED chips contain thermal vias for heat conduction, while areas between chips have reflective properties to enhance light output. This local differentiation resolves the contradiction between heat dissipation needs and light output requirements.
2Temperature
If a ceramic substrate with thermal vias is used, then heat dissipation is improved, but manufacturing complexity and cost increase due to additional layers and processes
Solution Approach 1:
The invention extracts the light-reflecting function from the thermal via structure by creating distinct light-reflecting areas that are separate from the thermal conduction paths. This eliminates the need for complex via structures that attempt to perform both thermal and optical functions, thereby simplifying manufacturing while maintaining heat dissipation efficiency.
Solution Approach 2:
Instead of trying to make thermal vias that also reflect light (which creates manufacturing complexity), the invention inverts the approach: it creates dedicated light-reflecting areas that are specifically designed for optical performance, while thermal vias are kept simple and dedicated to heat conduction only.
3Reliability
If LED chips are mounted on a ceramic substrate, then electrical insulation is provided, but thermal conduction efficiency is insufficient requiring additional heat spreaders and heat sinks
Solution Approach 1:
The invention merges the electrical insulation function and thermal conduction function into a single integrated substrate structure. The substrate simultaneously provides electrical isolation between the LED chip and mounting surface while incorporating thermal vias that efficiently conduct heat away from the chip, eliminating the need for separate heat spreader and heat sink components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light output by allowing light reflection from exposed substrate regions and improves heat dissipation, reducing thermal degradation and manufacturing complexity while maintaining efficient thermal paths.
Implementation Method 1
a reflective surface, where LED chips are mounted directly onto the substrate in spaced positions to allow for thermal dissipation and light reflection
Implementation Method 2
LED chips are mounted in direct contact with the reflective surface of the substrate to enable thermal dissipation
Data Source
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AI summary
An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.