LED Chromaticity Correction via Resin Dispensing Control
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Solution Overview
Problem
The manufacturing of LED packages faces challenges in achieving consistent chromaticity distribution due to process variations, leading to deviations from target chromaticity, which results in yield reduction and increased manufacturing costs, and inefficiencies in optical property testing before package separation.
Innovation Solution
A resin application apparatus and method that includes an optical property measurement unit to assess the LED chip's emitted light, determining the appropriate resin application amount based on measured optical properties, and an optical property correction apparatus to adjust the chromaticity by dispensing phosphor-containing resin, ensuring the chromaticity falls within a target range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed amount of phosphor-containing resin is applied to all LED chips, then the manufacturing process is simple and fast, but the chromaticity distribution is wide and deviates from target chromaticity
Solution Approach 1:
The patent measures the optical properties (peak wavelength, dominant wavelength) of each LED chip before applying the phosphor-containing resin. This preliminary measurement allows the system to determine the appropriate resin application amount based on the specific characteristics of each chip, thereby achieving consistent chromaticity across all LED packages while avoiding the need for complex post-manufacturing adjustments
Solution Approach 2:
The patent changes the application amount of phosphor-containing resin based on the measured optical parameters of each LED chip. By adjusting the resin amount according to the chip's peak wavelength and dominant wavelength, the system achieves uniform chromaticity output across different chips, resolving the contradiction between precision and simplicity
2Productivity
If optical property testing is performed after package separation, then each package can be individually tested, but the manufacturing efficiency is reduced due to additional handling time
Solution Approach 1:
The patent performs optical property measurements on LED chips before the resin application and curing processes. This preliminary measurement allows chromaticity verification to be completed earlier in the manufacturing flow, enabling more efficient process sequencing and reducing the need for post-separation testing, thereby improving overall manufacturing efficiency without compromising measurement accuracy
Solution Approach 2:
The system uses the LED chip's own emitted light to measure its optical properties before resin application. This self-measurement approach eliminates the need for additional external light sources or complex testing equipment later in the process, streamlining the manufacturing workflow while maintaining accurate optical characterization
3Reliability
If resin application amount is increased to compensate for chromaticity deviations, then more packages meet target chromaticity, but material waste increases and cost increases
Solution Approach 1:
The patent adjusts the resin application amount based on the measured optical parameters of each LED chip. By changing the resin amount to match the specific needs of each chip, the system achieves target chromaticity compliance without applying excessive resin, thereby reducing material waste and associated costs while maintaining high reliability
Solution Approach 2:
The patent applies different amounts of phosphor-containing resin to different LED chips based on their individual optical characteristics. This localized adjustment ensures that each chip receives the precise amount of resin needed to achieve target chromaticity, avoiding the material waste that would result from applying a uniform excessive amount to all chips
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces chromaticity distribution, increases production yield, and enhances manufacturing efficiency by allowing for precise control of resin application and correction before curing, ensuring LED packages meet target chromaticity specifications.
Implementation Method 1
an optical property measurement unit for measuring a wavelength of light emitted from an LED chip
Implementation Method 2
applying, as the resin, light conversion material-containing transparent resin
Data Source
AI summary
A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.