Thermally Conductive Metal LED Circuit Board with Anodized Insulating Layers
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Solution Overview
Problem
Conventional light emitting diode (LED) circuit boards have low thermal conductivity, leading to ineffective heat radiation and a complex, costly manufacturing process due to the use of insulating materials and separate fabrication of electrodes and conductive patterns.
Innovation Solution
A thermally conductive metal circuit board with insulating oxidation layers formed by anodizing, featuring first and second conductive patterns for improved heat dissipation and simplified manufacturing, where the board body is made of materials like aluminum or titanium, and the insulating layers are uniformly formed on edges and surfaces to enhance durability and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating materials are used for the circuit board, then electrical insulation is achieved, but thermal conductivity deteriorates leading to ineffective heat radiation
Solution Approach 1:
The circuit board uses a composite structure combining a thermally conductive metal base material with anodized insulating oxide layers on the surface. This allows the board to simultaneously achieve high thermal conductivity from the metal substrate and electrical insulation from the oxide coating, resolving the contradiction between thermal performance and electrical insulation.
2Reliability
If separate fabrication processes are used for electrodes and conductive patterns, then electrical functionality is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the electrode and conductive pattern fabrication into a single integrated process. The anodized oxide layers serve dual purposes as both insulating structures and as substrates for forming conductive patterns, eliminating the need for separate electrode fabrication steps and reducing manufacturing complexity.
Solution Approach 2:
The anodized oxide layers perform multiple functions simultaneously: they provide electrical insulation, serve as a base for conductive patterns, and act as structural elements of the circuit board. This multi-functionality reduces the number of separate components and processes needed, simplifying manufacturing.
3Reliability
If conventional insulating circuit boards are used, then electrical insulation is maintained, but productivity decreases due to complex manufacturing processes
Solution Approach 1:
The anodized insulating oxide layers are formed on the metal substrate before the conductive patterns are created. This preliminary formation of insulating structures eliminates the need for subsequent insulating layer deposition steps, streamlining the manufacturing process and improving productivity while maintaining electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively radiates heat from LEDs, simplifies the manufacturing process, reduces costs, and boosts productivity by using anodized insulating layers to integrate conductive patterns directly with the board body, allowing for efficient heat dissipation and durable LED packages.
Implementation Method 1
insulating layers are formed by anodizing on a portion of a thermally conductive board by anodizing
Implementation Method 2
insulating oxidation layers formed by anodizing
Data Source
AI summary
A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.