LED Circuit Board Pressing Spring for Lighting Devices
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Solution Overview
Problem
Existing lighting devices face challenges with heat dissipation and cost due to direct screw mounting of LED circuit boards, which requires expensive boards to handle screw torque and limits LED output due to inadequate heat-resistant resin reflection plates.
Innovation Solution
A lighting device design featuring an LED circuit board pressing spring that supports and presses adjacent circuit boards, eliminating the need for direct screw mounting and reducing stress on the boards, while using a resin reflection plate that doesn't require high heat resistance to handle higher LED outputs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If LED circuit board is screwed directly to device main body, then mounting is secure, but stress from screw tightening torque damages the circuit board and increases cost
Solution Approach 1:
A resin reflection plate is introduced as an intermediary component between the LED circuit board and device main body. The circuit board is mounted on the reflection plate, which in turn is mounted to the device main body. This mediator distributes the mounting stress and protects the circuit board from direct screw tightening torque, eliminating the need for expensive stress-resistant circuit boards while maintaining secure mounting.
2Ease of manufacture
If resin reflection plate is used to support LED circuit board, then cost is reduced, but heat resistant properties are insufficient for high output LEDs
Solution Approach 1:
The supporting function is extracted from the resin reflection plate and assigned to a dedicated metal support structure. The resin reflection plate is used solely for its optical reflection function and circuit board mounting surface, while the metal support structure handles the mechanical support and heat dissipation. This separation allows the use of inexpensive resin for the reflection plate while metal components manage the heat from high-output LEDs.
3Temperature
If high heat resistant resin reflection plate is used, then high output LEDs can be handled, but cost increases
Solution Approach 1:
The heat management function is extracted from the resin reflection plate and assigned to separate metal heat dissipation components. This allows the use of standard, low-cost resin reflection plates that do not require high heat resistance, while dedicated metal structures handle the thermal management for high-output LEDs.
4Strength
If screws are used to mount LED circuit board, then mounting is secure, but expensive circuit boards that can bear screw torque are required
Solution Approach 1:
The resin reflection plate serves as an intermediary mounting surface. Screws secure the reflection plate to the device main body, while the circuit board is mounted on the reflection plate using minimal fastening. The reflection plate absorbs the mechanical stress from screw tightening, allowing the use of standard, low-cost circuit boards that cannot withstand direct screw torque.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved assembly performance, reduces costs, and enables handling of higher LED outputs without the need for expensive circuit boards or high heat-resistant resin, enhancing mounting accuracy and heat dissipation.
Implementation Method 1
an LED circuit board pressing spring which presses the LED circuit boards
Implementation Method 2
a heat conducting sheet are mounted on the mounting plate
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A lighting device 10 includes: a device main body 11; an LED unit 18 which is mounted on a bottom surface of the device main body 11 and which includes a plurality of LEDs 19 which are mounted on a plurality of LED circuit boards 20; an optical member which is mounted on the device main body 11 on a front side of the LED unit 18; and an LED circuit board pressing spring 36 which supports the LED circuit boards 20 in the device main body 11.